Cleanroom testing is a very necessary process before the cleanroom is used by the owner after construction. Whether the cleanroom testing meets the standards will directly lead to whether the cleanroom meets the production requirements.

According to the standard of IES-RP-CC006.2 cleanroom test, the working state of cleanroom may fall into three states: empty, static and dynamic. The testing mode depends on the type of cleanroom design and the working state of cleanroom.

Working state of cleanroom

In the construction contract of cleanroom, only the most basic air test is usually specified, while the static and dynamic test is often omitted because of the tight schedule. However, we still recommend that both contractors and owners test the cleanroom under static and dynamic conditions. This will ensure that the construction of the cleanroom meets the design requirements. The comparison of test results under two different conditions, static and dynamic, will provide a very effective help for the analysis of the problems existing in the cleanroom.

For example, under static conditions, the cleanliness reaches the standard, while under dynamic conditions, it doesn’t meet the standard. This may be due to poor cleanroom management: non-standard cleaning when installing machines, inappropriate cleaning procedures, inadequate discipline management, incorrect machine placement (blocking the vent or blocking the air supply of filters), etc.

Therefore, we recommend that the cleanroom be tested in both static and dynamic conditions.

Cleanroom Performance Testing and Reference to Relevant Certification Standard

Cleanroom testing standards and practices

All cleanroom tests are basically based on internationally recognized standards (e.g. ISO14644-1; IEST-RP-CC006.2; NEBB manual and terminated FS-209E). These standards and practices provide the most basic guidance for cleanroom testing and certification. In fact, owners and builders of cleanrooms have different agreements on technical indicators, testing methods and acceptance standards of cleanrooms due to product and process requirements.

Therefore, most acceptance criteria are agreed upon by the owner and builder of the cleanroom through consultation and referring to the recommendations of the professional cleanroom testing and certification company. Since independent third-party testing and certification companies can usually propose suitable solutions for cleanroom testing, we recommend that owners and builders invite testing and certification companies to participate in the discussion of cleanroom technical parameters, testing methods and acceptance criteria. In case of disagreement on relevant parameters or standards, the testing and certification company will act as a mediator between the owner and the builder with their own expertise.

Selection of test items

The recommended cleanroom test items include the uniformity of the air velocity of the filter, leak detection of the filter installation, differential pressure, airflow parallelism, cleanliness, noise, illumination, humidity/temperature and so on. These are the basic test items, which include the main and auxiliary test items. These items should be consistent with the original design criteria and parameters of the clea room, and the test certification should be completed before the cleanroom is transferred to the owner.

Four main items (filter wind speed and uniformity, filter installation leak detection, differential pressure and cleanliness) are the most important and basic in all test items. It must be completed before the equipment enters the cleanroom. Other auxiliary test items such as airflow parallelism (only applicable to one-way flow clean room), temperature, humidity, illumination, noise also need to be completed, because they are related to the movement and environmental parameters of air in clean room. We believe that these auxiliary tests need to be done at least under dynamic conditions.

The performance test of cleanroom is a means to check whether the cleanroom project meets the standards, which will directly affect whether the cleanroom meets the production requirements. Therefore, enterprises should pay attention to the performance test of clean rooms.

1.This presentation addresses the walking test as described in ANSI/ESD STM 97.2. The use of this test method is required by any ESD control program claiming compliance to ANSI/ESD S20.20 when an ESD floor or ESD floor mat is used as primary ground for personnel. In these situations, the walking test must be performed during the qualification of the footwear flooring system. Testing must be performed for every footwear type used in 2020 compliant ESD program.

A test report, containing the findings, must be available as evidence that qualification testing was performed.

Footwear/Flooring System Walking Test Demonstration

2.For qualification testing, a sample of the intended floor is assembled according to the flooring manufacturer’s instructions and the sample is connected to ground. The size of the flooring sample shall be at least 91 cm x 91 cm so that an effective walking pattern can be established.

The test subject is connected to a charged plate monitor and a device that can record the voltage seen by charged plate monitor.

The ESD footwear that will be used with the static control flooring must be used for this test. ESD footwear can be ESD shoes, booties, heelstraps or sole grounders. Whichever type footwear is selected the footwear must be worn on both feet.

Footwear/Flooring System Walking Test Demonstration

3.ANSI/ESD STM97.2 requires that the test subject walk in a set pattern as shown in this slide. The test subject starts with their feet at positions 5 and 6. Once started the test subject moves without stopping until they return to the starting position. At this point the test subject pauses for at least two seconds before repeating the walking sequence. The walking pattern needs to be repeated a minimum of 10 times according to the test method or until the voltage stabilizes.

It is necessary to have equipment to measure and record the voltage on the person performing the test.

Footwear/Flooring System Walking Test Demonstration

4.The video on this slide demonstrates the walking pattern. As you can see the test subject pauses at the end fo the test cycle as required by the test method.

5.The slide shows an example of a walking test. The peak voltages for this footwear flooring combination are less than 100 volts which meets the requirements of ANSI/ESD S20.20.

Footwear/Flooring System Walking Test Demonstration

6.Please send any question concerning this presentation to [email protected].

 

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The electronics industry is continually shifting. Device density and technology is more complex. Electronics manufacturing is more heavily reliant on out-sourcing. The ESD industry seems to have jumped into this swirling eddy headfirst. ESD control programs have mushroomed. Black has been replaced by green, blue and gold. Shielding bags dominate the warehouse. Ionizers exist along side wrist straps and ground cords. An early history of “smoke and mirrors,” magic and lofty claims of performance is rapidly and safely being relegated to the past.

Today, more than ever, meeting the complex challenge of reducing ESD losses requires more than reliance on faith alone. Users require a way to legitimately evaluate and compare competing brands and types of products. They need objective confirmation that their ESD control program provides effective solutions to their unique ESD problems. Contract manufacturers and OEM’s require mutually agreed-upon ESD control programs that reduce duplication of process controls.

That’s where standards come into play. They provide guidance in developing programs that effectively address ESD process control. They help define the sensitivity of the products manufactured and used. They help define the performance requirements for various ESD control materials, instruments, and tools. Standards are playing an ever-increasing role in reducing marketplace confusion in the manufacture, evaluation, and selection of ESD control products and programs.

The Who and Why of Standards

Who uses ESD standards? Manufacturers and users of ESD sensitive devices and products, manufacturers and distributors of ESD control products, certification registrars, and third party testers of ESD control products.

Why use ESD standards? They help assure consistency of ESD sensitive products and consistency of ESD control products and services. They provide a means of objective evaluation and comparison among competitive ESD control products. They help reduce conflicts between users and suppliers of ESD control products. They help in developing, implementing, auditing, and certifying ESD control programs. And, they help reduce confusion in the marketplace.

In the United States, the use of standards is voluntary, although their use can be written into contracts or purchasing agreements between buyer and seller. In most of the rest of the world, the use of standards, where they exist, is compulsory.

Key Standards and Organizations

Just 20 years ago, there were relatively few reliable ESD standards and few ESD standards development organizations. Today’s ESD standards landscape is not only witnessing an increase in the number of standards, but also increasing cooperation among the organizations that develop them.

Today’s standards fall into three main groups. First, there are those that provide ESD program guidance or requirements. These include documents such as ANSI ESD S20.20-2007–Standard for the Development of an ESD Control Program, ANSI/ESD S8.1-Symbols-ESD Awareness , or ESD TR20.20-ESD Handbook.

A second group covers requirements for specific products or procedures such as packaging requirements and grounding. Typical standards in this group are ANSI/ESD S6.1-Grounding and ANSI/ESD S541 –Packaging Materials for ESD Sensitive Items.

A third group of documents covers the standardized test methods used to evaluate products and materials. Historically, the electronics industry relied heavily on test methods established for other industries or even for other materials (e. g., ASTM-257-DC Resistance or Conductance of Insulating Materials). Today, however, specific test method standards focus on ESD in the electronics environment, largely as a result of the ESD Association’s activity. These include standards such as ANSI/ESDA-JEDEC JS-001-2010-Device Testing, Human Body Model and ANSI/ESD STM7.1: Floor Materials — Resistive Characterization of Materials to cite just a few.

Who Develops Standards?

Standards development and usage is a cooperative effort among all organizations and individuals affected by standards. There are several key ESD standards development organizations.

Military Standards

Traditionally, the U.S. military spearheaded the development of specific standards and specifications with regard to ESD control in the U.S. Today, however, U.S. military agencies are taking a less proactive approach, relying on commercially developed standards rather than developing standards themselves. For example, the ESD Association completed the assignment from the Department of Defense to convert MIL-STD-1686 into a commercial standard called ANSI/ESD S20.20.

ESD Association

The ESD Association has been a focal point for the development of ESD standards in recent years. An ANSI-accredited standards development organization, the Association is charged with the development of ESD standards and test methods. The Association also represents the US on the International Electrotechnical Commission (IEC) Technical Committee 101-Electrostatics.

The ESD Association has published 36 standards documents and 23 Technical Reports. These voluntary standards cover the areas of material requirements, electrostatic sensitivity, and test methodology for evaluating ESD control materials and products. In addition to standards documents, the Association also has published a number of informational advisories. Advisory documents may be changed to other document types in the future.

ESD Association Standards Classifications and Definitions

There are four types of ESD Association standards documents with specific clarity of definition. The four document categories are consistent with other standards development organizations. These four categories are defined below.

  • Standard: A precise statement of a set of requirements to be satisfied by a material, product, system or process that also specifies the procedures for determining whether each of the requirements is satisfied.
  • Standard Test Method: A definitive procedure for the identification, measurement and evaluation of one or more qualities, characteristics or properties of a material, product, system or process that yields a reproducible test result.
  • Standard Practice: A procedure for performing one or more operations or functions that may or may not yield a test result. Note: If a test result is obtained, it may not be reproducible between labs.
  • Technical Report: A collection of technical data or test results published as an informational reference on a specific material, product, system, or process.

As new documents are approved and issued, they will be designated into one of these four new categories. Existing documents have been reviewed and have been reclassified as appropriate. Several Advisory Documents still exist and may be migrated to either Technical Reports or Standard Practices in the future.

International Standards

The international community, led by the European-based International Electrotechnical Commission (IEC), has also climbed on board the standards express. IEC Technical Committee 101 has released a series of documents under the heading IEC 61340. The documents contain general information regarding electrostatics, standard test methods, general practices and an ESD Control Program Development Standard that is technically equivalent to ANSI/ESD S20.20.  A Facility Certification Program is also available.  Global companies can seek to become certified to both ANSI/ESD S20.20 and to IEC61340-5-1 if they so choose. Japan also has released its proposed version of a national electrostatic Standard, which also shares many aspects of the European and U.S. documents.

Organizational Cooperation

Perhaps one of the more intriguing changes in ESD standards has been the organizational cooperation developing between various groups.  One cooperative effort was between the ESD Association and the U.S. Department of Defense, which resulted in the Association preparing ANSI/ESD S20.20 as a successor to MIL-STD-1686.  A second cooperative effort occurred between the ESD Association and JEDEC, which started with an MOU and resulted in the development of 2 documents: a joint HBM document was published in 2010; a joint CDM document will be published in 2011.

Internationally, European standards development organizations and the ESD Association have developed working relationships that result in an expanded review of proposed documents, greater input, and closer harmonization of standards that impact the international electronics community.

For users of ESD standards, this increased cooperation will have a significant impact. First, we should see standards that are technically improved due to broader input. Second, we should see fewer conflicts between different standards. Finally, we should see less duplication of effort.

Summary

For the electronics community, the rapid propagation of ESD standards and continuing change in the standards environment mean greater availability of the technical references that will help improve ESD control programs. There will be recommendations to help set up effective programs. There will be test methods and specifications to help users of ESD control materials evaluate and select products that are applicable to their specific needs. And there will be guidelines for vendors of ESD products and materials to help them develop products that meet the real needs of their customers.

Standards will continue to fuel change in the international ESD community.

Sources of Standards

ESD Association, 7900 Turin Road, Building 3, Rome, NY 13440. Phone: 315-339-6937. Fax: 315-339-6793. Web Site: http://www.esda.org

IHS Global Engineering Documents, 15 Inverness Way East, Englewood, CO 80112. Phone: 800-854-7179. Fax: 303-397-2740. Web Site: http://global.ihs.com

International Electrotechnical Commission, 3, rue de Varembe, Case postale 131, 1211 Geneva 20, Switzerland. Fax: 41-22-919-0300. Web Site: http://www.iec.ch/

Military Standards, Naval Publications and Forms Center, 5801 Tabor Avenue, Philadelphia, PA 19120

JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240-S
Arlington, VA  22201-2107, http://www.jedec.org

Principle ESD Standards

U.S. Military/Department of Defense

MIL-STD-1686C: Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices) This military standard establishes requirements for ESD Control Programs. It applies to U.S. military agencies, contractors, subcontractors, suppliers and vendors. It requires the establishment, implementation and documentation of ESD control programs for static sensitive devices, but does NOT mandate or preclude the use of any specific ESD control materials, products, or procedures. It is being updated and converted to a commercial standard by the ESD Association. Although DOD has accepted the new ANSI/ESD S20.20 document as a successor, it has not yet taken action to cancel STD-1686

MIL-HBDK-263B: Electrostatic Discharge Control Handbook for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices)
This document provides guidance, but NOT mandatory requirements, for the establishment and implementation of an electrostatic discharge control program in accordance with the requirements of MIL-STD-1686.

MIL-PRF 87893—Workstation, Electrostatic Discharge (ESD) Control
This document defines the requirements for ESD protective workstations.

MIL-PRF-81705—Barrier Materials, Flexible, Electrostatic Protective, Heat Sealable
This documents defines requirements for ESD protective flexible packaging materials.

MIL-STD-129—Marking for Shipment and Storage
Covers procedures for marketing and labeling ESD sensitive items.

ESD Association

Standards Documents

ANSI/ESD S1.1: Evaluation, Acceptance, and Functional Testing of Wrist Straps
A successor to EOS/ESD S1.0, this document establishes test methods for evaluating the electrical and mechanical characteristics of wrist straps. It includes improved test methods and performance limits for evaluation, acceptance, and functional testing of wrist straps.

ANSI/ESD STM2.1: Resistance Test Method for Electrostatic Discharge Protective Garments
This Standard Test Method provides test methods for measuring the electrical resistance of garments used to control electrostatic discharge. It covers procedures for measuring sleeve-to-sleeve and point-to-point resistance.

ANSI/ESD STM3.1-: Ionization 
Test methods and procedures for evaluating and selecting air ionization equipment and systems are covered in this standard. The document establishes measurement techniques to determine ion balance and charge neutralization time for ionizers.

ANSI/ESD SP3.3: Periodic Verification of Air Ionizers.
This Standard Practice provides test methods and procedures for periodic verification of the performance of air ionization equipment and systems (ionizers).

ANSI/ESD S4.1: Worksurfaces – Resistance Measurements
This Standard establishes test methods for measuring the electrical resistance of worksurface materials used at workstations for protection of ESD susceptible items. It includes methods for evaluating and selecting materials, and testing new worksurface installations and previously installed worksurfaces.

ANSI/ESD STM4.2: Worksurfaces – Charge Dissipation Characteristics
This Standard Test Method provides a test method to measure the electrostatic charge dissipation characteristics of worksurfaces used for ESD control. The procedure is designed for use in a laboratory environment for qualification, evaluation or acceptance of worksurfaces.

ESDA-JEDEC  JS-001: Electrostatic Discharge Sensitivity Testing — Human Body Model
This Standard Test Method updates and revises an existing Standard. It establishes a procedure for testing, evaluating and classifying the ESD sensitivity of components to the defined Human Body Model (HBM).

ANSI/ESD STM5.2): Electrostatic Discharge Sensitivity Testing — Machine Model
This Standard establishes a test procedure for evaluating the ESD sensitivity of components to a defined Machine Model (MM).  The component damage caused by the Machine Model is often similar to that caused by the Human Body Model, but it occurs at a significantly lower voltage.

ANSI/ESD STM5.3.1: Electrostatic Discharge Sensitivity Testing – Charged Device Model — Non-Socketed Mode
This Standard Test Method establishes a test method for evaluating the ESD sensitivity of active and passive components to a defined Charged Device Model (CDM).

ANSI/ESD SP5.3.2: Electrostatic Discharge Sensitivity Testing. – Socketed Device Method (SDM) – component Level.     
This standard practice provides a test method generating a Socketed Device Model (SDM) test on a component integrated circuit (IC) device.

ANSI/ESD SP5.4:  Latchup Sensitivity Testing of CMOS/BiCMOS Integrated Circuits. – Transient Latchup Testing – Component Level Suppl Transient simulation.
This standard practice method was developed to instruct the reader on the methods and materials needed to perform Transient latchup testing.

ANSI/ESD STM5.5.1:Electrostatic Discharge Sensitivity Testing – Transmission Line Pulse (TLP) – Component Level.
This document pertains to Transmission Line Pulse (TLP) testing techniques of semiconductor components. The purpose of this document is to establish a methodology for both testing and reporting information associated with TLP testing.

ANSI/ESD SP5.5.2Electrostatic Discharge Sensitivity Testing – Very Fast Transmission Line Pulse (VF-TLP) – Component Level 
This document pertains to Very Fast Transmission Line Pulse (VF-TLP) testing techniques of semiconductor components.  It establishes guidelines and standard practices presently used by development, research, and reliability engineers in both universities and industry for VF-TLP testing.  This document explains a methodology for both testing and reporting information associated with VF-TLP testing.

ANSI/ESD SP5.6:   Electrostatic Discharge Sensitivity Testing – Human Metal Model (HMM) – Component Level
Establishes the procedure for testing, evaluating, and classifying the ESD sensitivity of components to the defined HMM.

ANSI/ESD S6.1: Grounding  
This Standard recommends the parameters, procedures, and types of materials needed to establish an ESD grounding system for the protection of electronic hardware from ESD damage. This system is used for personnel grounding devices, worksurfaces, chairs, carts, floors, and other related equipment.

ANSI ESD S7.1: Floor Materials — Resistive Characterization of Materials 
Measurement of the electrical resistance of various floor materials such as floor coverings, mats, and floor finishes is covered in this document. It provides test methods for qualifying floor materials before installation or application and for evaluating and monitoring materials after installation or application.

ANSI ESD S8.1: ESD Awareness Symbols
Three types of ESD awareness symbols are established by this document. The first one is to be used on a device or assembly to indicate that it is susceptible to electrostatic charge. The second is to be used on items and materials intended to provide electrostatic protection. The third symbol indicates the common point ground

ANSI/ESD S9.1: Resistive Characterization of Footwear
This Standard defines a test method for measuring the electrical resistance of shoes used for ESD control in the electronics environment.

ANSI/ESD SP10.1: Automated Handling Equipment
This Standard Practice provides procedures for evaluating the electrostatic environment associated with automated handling equipment.

ANSI ESD STM11.11: Surface Resistance Measurement of Static Dissipative Planar Materials 
This Standard Test Method defines a direct current test method for measuring electrical resistance. The Standard is designed specifically for static dissipative planar materials used in packaging of ESD sensitive devices and components.

ANSI/ESD STM11.12: Volume Resistance Measurement of Static Dissipative Planar Materials
This Standard Test Method provides test methods for measuring the volume resistance of static dissipative planar materials used in the packaging of ESD sensitive devices and components.

ANSI/ESD STM11.13: Two-Point Resistance Measurement
This Standard Test Method provides a test method to measure the resistance between two points on an items surface.

ANSI ESD STM11.31: Evaluating the Performance of Electrostatic Discharge Shielding Bags 
This Standard provides a method for testing and determining the shielding capabilities of electrostatic shielding bags.

ANSI/ESD STM12.1: Seating-Resistive Characterization
This Standard provides test methods for measuring the electrical resistance of seating used to control ESD. The test methods can be used for qualification testing as well as for evaluating and monitoring seating after installation. It covers all types of seating, including chairs and stools.

ANSI/ESD STM13.1: Electrical Soldering/Desoldering Hand Tools
This Standard Test Method provides electric soldering/desoldering hand tool test methods for measuring the electrical leakage and tip to ground reference point resistance and provides parameters for EOS safe soldering operation.

ANSI/ESD SP15.1: Standard Practice for In-Use Testing of Gloves and Finger Cots
This document provides test procedures for measuring the intrinsic electrical resistance of gloves and finger cots as well as their electrical resistance together with personnel as a system.

ANSI ESD S20.20: Standard for the Development of an ESD Control Program
This Standard provides administrative, technical requirements and guidance for establishing, implementing and maintaining an ESD Control Program.

ANSI/ESD STM97.1: Floor Materials and Footwear – Resistance in Combination with a Person.
This Standard Test Method provides for measuring the electrical resistance of floor materials, footwear and personnel together, as a system.

ANSI/ESD STM97.2- Floor Materials and Footwear Voltage Measurement in Combination with a Person
This Standard Test Method provides for measuring the electrostatic voltage on a person in combination with floor materials and footwear, as a system.

Advisory Documents

Advisory Documents and Technical Reports are not Standards, but provide general information for the industry or additional information to aid in better understanding of Association Standards.

  • ESD ADV1.0: Glossary of Terms
    Definitions and explanations of various terms used in Association Standards and documents are covered in this Advisory. It also includes other terms commonly used in the ESD industry.
  • ESD ADV3.2: Selection and Acceptance of Air Ionizers
    This Advisory document provides end users with guidelines for creating a performance specification for selecting air ionization systems. It reviews four types of air ionizers and discusses applications, test method references, and general design, performance and safety requirements.
  • ESD ADV11.2: Triboelectric Charge Accumulation Testing
    The complex phenomenon of triboelectric charging is discussed in this Advisory. It covers the theory and effects of tribocharging. It reviews procedures and problems associated with various test methods that are often used to evaluate triboelectrification characteristics. The test methods reviewed indicate gross levels of charge and polarity, but are not necessarily repeatable in real world situations.
  • ESD TR53.1: ESD Protective Workstations
    This Advisory document defines the minimum requirements for a basic ESD protective workstation used in ESD sensitive areas. It provides a test method for evaluating and monitoring workstations. It defines workstations as having the following components: support structure, static dissipative worksurface, a means of grounding personnel, and any attached shelving or drawers.
  • ESD TR 20.20: ESD Handbook
    New handbook provides detailed guidance for implementing an ESD control program in accordance with ANSI/ESD S20.20.

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In Part Two of this series, we indicated that a key element in a successful static control program was the identification of those items (components, assemblies, and finished products) that are sensitive to ESD and the level of their sensitivity. Damage to an ESDS device by the ESD event is determined by the device’s ability to dissipate the energy of the discharge or withstand the current levels involved. This is known as device “ESD sensitivity” or “ESD susceptibility”.

Some devices may be more readily damaged by discharges occurring within automated equipment, while others may be more prone to damage from handling by personnel. In this article we will cover the models and test procedures used to characterize, determine, and classify the sensitivity of components to ESD. These test procedures are based on the two primary models of ESD events: Human Body Model (HBM) and Charged Device Model (CDM). The models used to perform component testing cannot replicate the full spectrum of all possible ESD events. Nevertheless, these models have been proven to be successful in reproducing over 99% of all ESD field failure signatures. With the use of standardized test procedures, the industry can

  • Develop and measure suitable on-chip protection.
  • Enable comparisons to be made between devices.
  • Provide a system of ESD sensitivity classification to assist in the ESD design and monitoring requirements of the manufacturing and assembly environments.
  • Have documented test procedures to ensure reliable and repeatable results.

Human Body Model (HBM) Testing

One of the most common causes of electrostatic damage is the direct transfer of electrostatic charge through a significant series resistor from the human body or from a charged material to the electrostatic discharge sensitive (ESDS) device. When one walks across a floor, an electrostatic charge accumulates on the body. Simple contact of a finger to the leads of an ESDS device or assembly allows the body to discharge, possibly causing device damage. The model used to simulate this event is the Human Body Model (HBM).

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Figure 1: Typical Human Body Model Circuit

The Human Body Model is the oldest and most commonly used model for classifying device sensitivity to ESD. The HBM testing model represents the discharge from the fingertip of a standing individual delivered to the device. It is modeled by a 100 pF capacitor discharged through a switching component and a 1.5kW series resistor into the component. This model, which dates from the nineteenth century, was developed for investigating explosions of gas mixtures in mines. It was adopted by the military in MIL-STD-883 Method 3015, and is referenced in ANSI/ESDA-JEDEC JS-001-2010: Electrostatic Discharge Sensitivity Testing — Human Body Model.  This document replaces the previous ESDA and JEDEC methods, STM5.1-2007 and JESD22-A114F respectively.  A typical Human Body Model circuit is presented in Figure 1.

Testing for HBM sensitivity is typically performed using automated test systems. The device is placed in the test system and contacted through a relay matrix. ESD zaps are applied.  A part is determined to have failed if it does not meet the datasheet parameters using parametric and functional testing.

Charged Device Model (CDM) Testing

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Figure 3: Typical Charged Device Model Test

The transfer of charge from an ESDS device is also an ESD event. A device may become charged, for example, from sliding down the feeder in an automated assembler. If it then contacts the insertion head or another conductive surface, which is at a lower potential, a rapid discharge may occur from the device to the metal object. This event is known as the Charged Device Model (CDM) event and can be more destructive than the HBM for some devices. Although the duration of the discharge is very short–often less than one nanosecond–the peak current can reach several tens of amperes.

The device testing standard for CDM (ESD STM5.3.1: Electrostatic Discharge Sensitivity Testing – Charged Device Model) was originally published in 1999.  The test procedure involves placing the device on a field plate with its leads pointing up, then charging it and discharging the device. Figure 3 illustrates a typical CDM test circuit.  The CDM 5.3.1 ESDA document was last published in 2009.

Other Test Methods

Machine Model (MM) Testing

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Figure 2: Typical Machine Model Circuit

A discharge which is different in shape and size to the HBM event also can occur from a charged conductive object, such as a metallic tool, or an automatic equipment or fixture. Originating in Japan as the result of trying to create a worst-case HBM event, the model is known as the Machine Model. This ESD model consists of a 200 pF capacitor discharged directly into a component with no series DC resistor in the output circuitry.   The industry is in the process of removing this model from qualification requirements.   The technical background on this change is described in Industry Council White Paper 1, “A Case for Lowering Component Level HBM/MM ESD Specifications and Requirements.”

As a worst-case human body model, the Machine Model may be over severe. However, there are real-world situations that this model may simulate, for example the rapid discharge from the metallic contacts on a charged board assembly or from the charged cables or handles/arms of an automatic tester.

Testing of devices for MM sensitivity using ESD Association standard ESD STM5.2: Electrostatic Discharge Sensitivity Testing — Machine Model is similar in procedure to HBM testing. The test equipment is the same, but the test head is slightly different. The MM version does not have a 1,500 ohm resistor, but otherwise the test board and the socket are the same as for HBM testing. The series inductance, as shown in Figure 2, is the dominating parasitic element that shapes the oscillating machine model wave form. The series inductance is indirectly defined through the specification of various waveform parameters like peak currents, rise times and the period of the waveform.  The MM 5.2 document was last published in 2009.

Socketed Device Model (SDM) Testing

SDM testing is similar to testing for HBM and MM sensitivity. The device is placed in a socket, charged from a high-voltage source and then discharged. This model was originally intended to provide an efficient way to do CDM testing.  However, the model did not have sufficient correlation with the CDM standard and there was too great a dependency on the specific design of the SDM tester. A Standard Practice (SP) document (SP),  SDM-5.3.2, was first published in 2002, and re-published in 2008.   A technical report, ESD TR5.3.2 (formerly TR08-00) : Socket Device Model (SDM) Tester is also available from the ESD Association.

Device Sensitivity Classification

The HBM and CDM  methods include a classification system for defining the component sensitivity to the specified model (See Tables 1 and 2). These classification systems have a number of advantages. They allow easy grouping and comparing of components according to their ESD sensitivity and the classification gives you an indication of the level of ESD protection that is required for the component.

Table 1
ESDS Component Sensitivity Classification – Human Body Model
(Per ESD STM5.1-2007)
Class Voltage Range
Class 0 <250 volts
Class 1A 250 volts to <500 volts
Class 1B 500 volts to < 1,000 volts
Class 1C 1000 volts to < 2,000 volts
Class 2 2000 volts to < 4,000 volts
Class 3A 4000 volts to < 8000 volts
Class 3B ≥ 8000 volts
Table 2
ESDS Component Sensitivity Classification – Charged Device Model
(Per ESD STM5.3.1-2009)
Class Voltage Range
Class C1 <125 volts
Class C2 125 volts to <250 volts
Class C3 250 volts to <500 volts
Class C4 500 volts to <1,000 volts
Class C5 1,000 volts to <1,500 volts
Class C6 1,500 volts to <2,000 volts
Class C7 ≥ 2,000 volts

A fully characterized component should be classified using Human Body Model,  and Charged Device Model. For example, a fully characterized component may have 2 of the following: Class 1B (500 volts to <1000 volts HBM) and Class C3 (500 volts to <1000 volts CDM). This would alert a potential user of the component to the need for a controlled environment, whether assembly and manufacturing operations are performed by human beings or machines.

A word of caution; however, these classification systems and component sensitivity test results function as guides, not necessarily as absolutes. The events defined by the test data produce narrowly restrictive data that must be carefully considered and judiciously used. The two ESD models represent discrete points used in an attempt to characterize ESD vulnerability. The data points are informative and useful, but to arbitrarily extrapolate the data into a real world scenario can be misleading. The true utility of the data is in comparing one device with another and to provide a starting point for developing your ESD control programs.

Summary

Device failure models and device test methods define the sensitivity of the electronic devices and assemblies to be protected from the effects of ESD. With this key information, you can design more effective ESD control programs.

For Further Reference

  • ESD STM5.1-2007: Electrostatic Discharge Sensitivity Testing — Human Body Model, ESD Association, Rome, NY.
  • ESD STM5.2-2009: Electrostatic Discharge Sensitivity Testing — Machine Model, ESD Association, Rome, NY.
  • ESD STM5.3.1-2009: Electrostatic Discharge Sensitivity Testing — Charged Device Model, ESD Association, Rome, NY.
  • ESD TR 5.3.2- (formerly TR08-00): Socket Device Model (SDM) Tester, ESD Association, Rome, NY.
  • ESD Industry Council White Paper 1: “A Case for Lowering Component Level HBM/MM ESD Specifications and Requirements,” August 2008.
  • ESD Industry Council White Paper 2: “A Case for Lowering Component Level CDM ESD Specifications and Requirements,” March 2009.
  • “A Closer Look at the Human ESD Event,” Hyatt, Hugh, et al, EOS/ESD Symposium Proceedings, 1981, ESD Association, Rome, NY.
  • “Charged Device Model Testing: Trying to Duplicate Reality,” Avery, L.R., EOS/ESD Symposium Proceedings, 1987, ESD Association, Rome, NY.
  • “Critical Issues Regarding ESD Sensitivity Classification Testing,” Pierce, Donald C., EOS/ESD Symposium Proceedings,1987, ESD Association, Rome, NY.
  • “Beyond MIL HBM Testing – How to Evaluate the Real Capability of Protection Structures, Avery, L.R., EOS/ESD Symposium Proceedings, 1991, ESD Association, Rome, NY.
  • “Mechanisms of Charged-Device Electrostatic Discharges,” Renninger, Robert G., EOS/ESD Symposium Proceedings, 1991, ESD Association, Rome, NY.
  • “Analysis of HBM ESD Testers and Specifications Using a 4th Order Lumped Element Model,” Verhaege, Koen, et al, EOS/ESD Symposium Proceedings, 1993, ESD Association, Rome, NY.
  • “A Comparison of Electrostatic Discharge Models and Failure Signatures for CMOS Integrated Circuit Devices,” Kelly, M., et al, EOS/ESD Symposium Proceedings, 1995, ESD Association, Rome, NY.
  • “Study of ESD Evaluation Methods for Charged Device Model,” Wada, Tetsuaki, EOS/ESD Symposium Proceedings, 1995, ESD Association, Rome, NY.
  • “A Compact Model for the Grounded-Gate nMOS Behavior Under CDM ESD Stress,” Russ, Christian, et al, EOS/ESD Symposium Proceedings, 1996, ESD Association, Rome, NY.
  • “Recommendations to Further Improvements of HBM ESD Component Level Test Specifications,” Verhaege, Koen, et al, EOS/ESD Symposium Proceedings, 1996, ESD Association, Rome, NY.
  • “Very Fast Transmission Line Pulsing of Integrated Structures and the Charged Device Model,” Gieser, H., and Haunschild, M., EOS/ESD Symposium Proceedings, 1996, ESD Association, Rome, NY.
  • “Investigation into Socketed CDM (SDM) Tester Parasitics,” Chaine, M., et al, EOS/ESD Symposium Proceedings, 1998, ESD Association, Rome, NY.
  • “Issues Concerning CDM ESD Verification Modules-The Need to Move to Alumina,” Henry, L.G., et al, EOS/ESD Symposium Proceedings, 1999, ESD Association, Rome, NY.
  • “The Importance of Standardizing CDM ESD Test Head Parameters to Obtain Data Correlation,” Henry, L.G., et al, EOS/ESD Symposium Proceedings, 2000, ESD Association, Rome, NY.
  • “Component Level ESD Testing,” Review Paper, Verhaege, Koen, Microelectronics Reliability Journal, 1998.

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Your static control program is up and running. How do you determine whether it is effective? How do you make sure your employees follow it? In Part Three, we covered basic static control procedures and materials of your ESD control program.  In Part Four, we will focus on two ESD control program plan requirements: training and compliance verification auditing. Per ANSI/ESD S20.20 and IEC 61340-5-1 the written ESD control plan is to include a training plan and a compliance verification plan.

Personnel Training

The procedures are in place. The materials are in use. But, your ESD control program just does not seem to yield the expected results. Failures declined initially, but they have begun reversing direction. Or perhaps there was little improvement. The solutions might not be apparent in inspection reports of incoming ESD protective materials. Nor in the wrist strap log of test results. In large companies or small, it is hard to overestimate the role of training in an ESD control program. ANSI/ESD S20.20 and IEC 61340-5-1 ESD Control Program standards cite training as a basic administrative requirement within an ESD control program. There is significant evidence to support the contribution of training to the success of the program. We would not send employees to the factory floor without the proper soldering skills or the knowledge to operate the automated insertion equipment. We should provide them with the same skill level regarding ESD control procedures.

Elements of Effective Training Programs

Although individual requirements cause training programs to vary from company to company, there are several common threads that run through the successful programs.

Successful training programs cover all affected employees.

Obviously we train the line employees who handle ESD sensitive devices and typically test their wrist straps or place finished products in static protective packaging. But we also include department heads, upper management, and executive personnel in the process. Typically they are responsible for the day-to-day supervision and administration of the program or they provide leadership and support. Even subcontractors and suppliers should be considered for inclusion in the training program if they are directly involved in handling your ESD sensitive components, sub-assemblies or products. Because ESD control programs cover such a variety of job disciplines and educational levels, it may be necessary to develop special training modules for each organizational entity. For example, the modules developed for management, engineering, assembly technicians and field service could differ significantly from one another because their day-to-day concerns and responsibilities are much different. Also the different education and skills should be considered.

Effective training is comprehensive and consistent.

Training not only covers specific procedures, but also the physics of the problem and the benefits of the program as well. Consistent content across various groups, facilities, and even countries (adjusted for cultural differences) reduces confusion and helps assure conformance. The training content should include topics such as the fundamentals of static electricity and electrostatic discharges, the details of the organization’s ESD Control Program plan, and each person’s role in the plan.

Use a variety of training tools and techniques.

Choose the methods that will work best for your organization. Combine live instruction with training videos or interactive computer-based programs. You may have in-house instructors available, or you may need to go outside the company to find instructors or training materials. You can also integrate industry symposia, tutorials, and workshops into your program. Consider using this “Fundamentals of ESD” series of articles. Effective training involves employees in the process. Reinforce the message with demonstrations of ESD events and their impact. Bulletin boards, newsletters, and posters provide additional reminders and reinforcement. Maintaining a central repository for educational ESD control materials will help your employees keep current or answer questions that may occur outside the formal training sessions. Materials in such a repository might include

  • Material from initial and recurring training sessions
  • ESD Association or internal bulletins or newsletters
  • DVDs or CDs
  • Computer based training materials
  • Technical papers, studies, standards (e.g. ESD Association, IEC, JEDEC), test methods and technical reports
  • ESD control material and equipment product technical data sheets

In addition, a knowledgeable person in the organization should be available to answer trainee questions once they have begun working.

Test, certify and retrain

Your training should assure comprehension, material retention and emphasize the importance of the effort. If properly implemented, testing and certification motivates and builds employee pride. Retraining or refresher training is an ongoing process that reinforces, reminds, and provides opportunities for implementing new or improved procedures. Establish a system to highlight when employees are due for retraining, retesting, or recertification.

Feedback, compliance verification, and measurement

Motivate and provide the mechanism for program improvement. Sharing yield or productivity, quality, and reliability data with employees demonstrates the effectiveness of the program and of their efforts. Tracking these same numbers can indicate that it’s time for retraining or whether modifications are required in the training program.

Design and delivery of an effective ESD training program can be just as important as the procedures and materials used in your ESD control program. Without an effective personnel training program, investments in ESD materials can be wasted. A training program that is built on identifiable and measurable performance goals helps assure employee understanding, implementation and success.

A key method of training effectiveness is observation of the operator in the EPA following ESD control procedures and precautions. Non-compliance with required ESD control program practices should be treated in the same manner of other impermissible actions that are handled through the company’s disciplinary process. This includes verbal warnings, re-training, written warnings, and eventually re-assignment or termination.

Compliance Verification Auditing

Developing and implementing an ESD control program itself is obvious. What might not be so obvious is the need to continually review, verify, analyze, feedback and improve. You will be asked to continually identify the program’s financial return on investment and to justify expenditures with the cost savings realized. Technological changes will dictate improvements and modifications. Feedback to employees and top management is essential. Management commitment will need continuous reinforcement.

Like training, regular program compliance verification and auditing becomes a key factor in the successful management of ESD control programs. The mere presence of the auditing process spurs compliance with program procedures. It helps strengthen management’s commitment. Program compliance verification reports should trigger required corrective action and help foster continuous improvement.

The benefits to be gained from regular compliance verification of ESD control procedures are numerous.

  • Prevent problems before they occur rather than always fighting fires.
  • Identify problems and take corrective action.
  • Identify areas in which our programs may be weak and provide us with information required for continuous improvement.
  • Leverage limited resources effectively.
  • Determine when our employees need to be retrained.
  • Improve yields, productivity, and reliability.
  • Bind our ESD program together into a successful effort.

An ESD control program compliance verification audit measures performance to the ESD Control Program Plan’s required limits. Typically, we think of the ESD program compliance verification as a periodic review and inspection of the ESD protective area (EPA) verifying the correct use of packaging materials, wearing of wrist straps, following defined procedures, and similar items. Auditing can range from informal surveys of the processes and facilities to the more formal third-party audits for ISO 9000 or ANSI/ESD S20.20 certification.

Requirements for Effective Compliance Verification

Regardless of the structure, effective compliance verification revolves around several factors. First, the existence of a written and well-defined ESD Control Program Plan with defined required limits for each EPA ESD control item. It is difficult to measure performance if you do not have anything to measure against. Yet, you quite frequently hear an auditor ask, “Some people say you should measure less than 500 volts in an EPA, but others say you should measure less than 100 volts. What’s acceptable when I audit the factory floor?” Obviously, this question indicates a lack of a formal ESD Control Program Plan defined required limits and test procedures, and the audit will be relatively ineffective.

Second, the taking of some measurements – typically measuring resistance and detecting the presence of charge or fields. Therefore, you will need test equipment to conduct EPA compliance verification. As a minimum, you will need an electrostatic field meter, a high range resistance meter, a ground AC outlet tester, and appropriate electrodes and accessories.

Third, include all areas in which ESD control is required to protect electrostatic discharge sensitive (ESDS) items. Typically included are receiving, inspection, stores and warehouses, assembly, test and inspection, research and development, packaging, field service repair, offices and laboratories, and cleanrooms. All of the areas listed in the ESD Control Program Plan are subject to compliance verification. Even the areas that are excluded from the plan need to be reviewed to ensure that unprotected ESDS devices are not handled in those areas. In the event that devices do enter those areas (e.g. Engineering and Design), mechanisms must be put in place to ensure that the devices are handled as non-conforming product.

Similarly, we need to audit all of the various processes, materials, and procedures that are used in our ESD control programs – personnel, equipment, wrist straps, floors, clothing, worksurfaces, continuous monitors, seating, training, and grounding. Fourth, we need to conduct compliance verification audits frequently and regularly. However, the user must determine the frequency (and if sampling is appropriate). Per Compliance Verification ESD TR53 ANNEX A Test Frequency “The objective of the periodic test procedures listed in this document is to identify if significant changes in ESD equipment and materials performance have occurred over time. Test frequency limits are not listed in this document, as each user will need to develop their own set of test frequencies based on the critical nature of those ESD sensitive items handled and the risk of failure for the ESD protective equipment and materials.

Examples of how test frequencies are considered: Daily wrist strap checks are sufficient in some applications, where in other operations constant wrist strap monitoring may be used for added operator grounding reliability. Packaging checks may depend on the composition of the packaging and its use. Some packaging may have static control properties that deteriorate more quickly with time and use and some packaging may be humidity dependent and may have limited shelf life. Some materials, such as ESD floor finishes, may require more frequent monitoring because of their lack of permanency. Other materials, such as ESD vinyl floor covering, may require less monitoring.

The testing of a floor should also be considered after maintenance on the floor has been performed.” The actual frequency of compliance verification audits depends upon your facility and the ESD problems that you have. Following an ESD Control Program initial audit, some experts recommend auditing each department once a month if possible and probably a minimum of six times per year. If this seems like a high frequency level, remember that these regular verification audits are based upon a sampling of work areas in each department, not necessarily every workstation. Once you have gotten your program underway, your frequency of audit will be based on your experience. If your audits regularly show acceptable levels of conformance and performance, you can reduce the frequency and the sampling.

If, on the other hand, your audits regularly uncover continuing problems, you will want to increase the frequency and the sampling. Fifth, we need to maintain trend charts and detailed records and prepare reports. They help assure that specified procedures are followed on a regular basis. The records are essential for quality control purposes, corrective action and compliance with ISO-9000. Finally, upon completion of the compliance verification audit, it is essential to implement corrective action if deficiencies are discovered. Trends need to be tracked and analyzed to help establish corrective action, which may include retraining of personnel, revision of requirement documents or processes, or modification of the existing facility.

Types of Audits

There are three types of ESD audits: program management audits, quality process checking, and ESD Control Program compliance verification (work place) audits. Each type is distinctively different and each is vitally important to the success of the ESD program.

Program management audits measure how well a program is managed and the strength of the management commitment. The program management audit emphasizes factors such as the existence of an effective implementation plan, realistic program requirements, ESD training programs, regular compliance verification audits, and other critical factors of program management. The program management audit typically is conducted by a survey specifically tailored to the factors being reviewed. Because it’s a survey, the audit could be conducted without actually visiting the site. The results of this audit indirectly measure work place compliance and are particularly effective as a means of self-assessment for small companies as well as large global corporations.

Quality process checking applies statistical quality control techniques to the ESD process and is performed by operations personnel. This is not a periodic verification audit, but rather tracking daily effectiveness of the program. Visual and electrical checks of the procedures and materials, wrist strap testing for example, are used to monitor the quality of the ESD control process. Checking is done on a daily, weekly or monthly basis. Trend charts and detailed records trigger process adjustments and corrective action. They help assure that specified procedures are followed on a regular basis. The records are essential for quality control purposes, corrective action and compliance with ISO-9000.

ESD Control Program Compliance Verification audits verify that program procedures are followed and that ESD control materials and equipment are within required limits or are functioning properly. Compliance Verification audits are performed on a regular basis, often monthly, and utilize sampling techniques and statistical analysis of the results. The use of detailed checklists and a single auditor assures that all items are covered and that the audits are performed consistently over time.

Basic Auditing Instrumentation

Special test equipment will be required to conduct EPA compliance verification. The specific test equipment will depend on what you are trying to measure, the precision you require and the sophistication of your static control and material evaluation program. However, as a minimum, you will need an electrostatic field meter, a high range resistance meter, a ground/AC outlet tester, and appropriate electrodes and accessories. Additional test equipment might include a charged plate monitor, footwear and wrist strap testers, chart recorders/data acquisition systems and timing devices, discharge simulators, and ESD event detectors. Although this equipment must be accurate and calibrated according to the vendor’s recommendations, it needs not be as sophisticated as laboratory instruments. The compliance verification audit is intended to verify basic functions and not for product qualification of ESD control equipment or materials. The compliance verification audit is intended to verify basic functions and not as a product qualification of ESD control items or materials. You want the right tool for the job. Just as you would not buy a hammer if you are were planning to saw wood, you would not purchase an electrometer to measure static voltages on a production line. Remember, many of the test equipment you might choose for compliance verification are good indicators, but not suitable for precise evaluation of materials. However, be sure that you can correlate the measurements obtained on the factory floor with those obtained in the laboratory. If you are making measurements according to specific standards or test methods, be sure the instrumentation meets the requirements of those documents.

With a hand-held electrostatic field meter, you can measure the presence of electrostatic fields in your environment allowing you to identify problems and monitor your ESD control program. These instruments measure the electrostatic field associated with a charged object. Many electrostatic field meters simply measure the gross level of the electrostatic field and should be used as general indicators of the presence of a charge and the approximate level of electrical potential of the charge. Others will provide more precise measurement for material evaluation and comparison.

For greater precision in facility measurements or for laboratory evaluation, a charged plate monitor is a useful instrument that can be used in many different ways; for example to evaluate the performance of flooring materials or measuring the offset voltage (balance) and discharge times of ionizers.

Because grounding is so important, resistance is one of the key factors in evaluating ESD control materials. A high range resistance meter becomes a crucial instrument. Most resistance measurements are made using a 100 volt or 10 volt test voltage. The resistance meter you choose should be capable of applying these voltages to the materials being tested. In addition, the meter should be capable of measuring resistance ranges of 103 to 1012 ohms. With the proper electrodes and cables, you will be able to measure the resistance of flooring materials, worksurfaces, equipment, furniture, garments, and some packaging materials.

The final instrument is a ground/AC outlet tester. With this device you can measure the continuity of your ESD grounds, check the impedance of the equipment grounding conductor (3rd wire AC ground) as well as verify that the wiring of power outlets in the EPA is correct.

Areas, Processes, and Materials to be Audited

Previously we stated that ESD protection was required “wherever unprotected ESD sensitive devices are handled.” Obviously, our audits need to include these same areas. Table 1 indicates some of the physical areas that may be part of the ESD Control Program Plan and therefore will be involved in Compliance Verification Audits. Remember, some areas may be excluded from the Plan depending on the Scope of the Plan.

As noted in Part 3 Table 1 Typical Facility Areas Requiring ESD Protection

Table 1
Typical Facility Areas Requiring ESD Protection
Receiving
Inspection
Stores and Warehouses
Assembly
Test and Inspection
Research and Development
Packaging
Field Service Repair
Offices and Laboratories
Cleanrooms

Similarly, we need to conduct Compliance Verification audits of all the various requirements that are used in our ESD Control Program Plan. Some of these are shown in Table 2.

Table 2
Typical Processes, Materials and Procedures
Personnel
Wrist Straps
Floors, Floor Mats, Floor Finishes
Shoes, Foot Grounders, Casters
Garments
Mobile Equipment (Carts, trolleys, lift trucks)
Workstations
Worksurfaces
Packaging and Materials Handling
Ionization
Grounding
Continuous Monitors
Seating
Production Equipment
Tools and Equipment (Soldering irons, fixtures, etc.)
Marking
Purchasing Specifications and Requisitions
ESD Measurement and Test Equipment
Personnel Training

Checklists

Checklists can be helpful tools for conducting Compliance Verification audits. However, it is important that ESD control program requirements are well documented and accessible to avoid a tendency for checklists becoming de facto lists of requirements. Table 3 indicates the type of questions and information that might be included in an auditing checklist. Other checklists are in the ESD Handbook ESD TR20.20 section 4.3.3. Your own checklists, of course, will be based on your specific needs and program requirements. They should conform to your actual ESD control procedures and specifications and they should be consistent with any ISO 9000 requirements you may have. For ANSI/ESD S20.20 based ESD Control Programs, the recognized Certification Bodies (Registrars) use a formal checklist supplied by the ESD Association to aid in conducting the Certification Audit.

In addition to checklists, you will use various forms for recording the measurements you make: resistance, voltage generation, etc. Part of your compliance verification audit will also include the daily logs used on the factory floor such as those used for wrist strap checking.

Table 3
Partial Audit Checklist – ESD Control Program
Function/Area Audited: Facilities
Date:

By:

Audit Questions Y N Comments
1. Where ESD protective flooring is used for personnel grounding, are ESD footwear worn?      
2. Where ESD floors and footwear are used for personnel grounding, do personnel check and log continuity to ground upon entering the EPA?      
3. Are personnel wearing grounded wrist straps at the ESD protective workstations (if required)?      
4. Are personnel checking wrist straps for continuity or using a continuous monitor?      
5. Where continuous monitors are not used, are wrist straps checked and logged routinely and at frequent intervals?      
6. Are wrist strap checkers and continuous monitors checked and maintained periodically?      
7. Are wrist strap cords checked, on the person, at the workstation?      
8. Are disposable foot grounders limited to one time use?      
9. Are test records for wrist straps and foot grounders kept and maintained?      
10. When required, are ESD protective garments correctly worn?      
11. Are nonessential personal items kept out of the EPA?      
12. Are personnel working in the EPA currently certified or escorted?      
13.  Are ESD Control requirements imposed on visitors to the EPA?      

Reporting and Corrective Action

Upon completion of the compliance verification auditing process, Reports should be prepared and distributed in a timely manner. Details of the audits need to be fully documented for ISO-9000 or ANSI/ESD S20.20 certification. As with all audits, it is essential to implement corrective action if deficiencies are discovered. Trends need to be tracked and analyzed to help establish corrective action, which may include retraining of personnel, revision of requirement documents or processes, or modification of the existing facility.

Conclusion

Compliance verification and personnel ESD control training are key ANSI/ESD S20.20 and IEC 61340-5-1 requirements to maintain an effective ESD control program. They help assure that ESDS handling procedures are properly implemented and can provide a management tool to gauge program effectiveness and to make continuous improvement.

For Further Reference

  • ANSI/ESD 20.20—Electrostatic Discharge Control Program, ESD Association, Rome, NY
  • ESD TR20.20-2001, ESD Control Handbook , ESD Association, Rome, NY.
  • “An Effective ESD Awareness Training Program,” Owen J. McAteer, EOS/ESD Symposium Proceedings, 1980, ESD Association, Rome, NY.
  • “Facility Evaluation: Isolating Environmental ESD Issues,” Stephen A. Halperin, EOS/ESD Symposium Proceedings, 1980, ESD Association, Rome, NY.
  • “The Production Operator: Weak Link or Warrior in the ESD Battle?” G. E. Hansel, EOS/ESD Symposium Proceedings, 1983,ESD Association, Rome, NY
  • “A Realistic and Systematic ESD Control Plan,” G. T. Dangelmayer, EOS/ESD Symposium Proceedings, 1984, ESD Association, Rome, NY.
  •   “Employee Training for Successful ESD Control,” G. T. Dangelmayer, E. S. Jesby, EOS/ESD Symposium Proceedings, 1985, ESD Association, Rome, NY
  • “A Tailorable ESD Control Program for the Manufacturing Environment,” Norman B. Fuqua, EOS/ESD Symposium Proceedings, 1986, ESD Association, Rome, NY.
  • “Internal Quality Auditing and ESD Control,” D. H. Smith, C.D. Rier, EOS/ESD Symposium Proceedings, 1986, ESD Association, Rome, NY
  • “Developing and Maintaining an Effective ESD Training Program,” F. Dinger, EOS/ESD Symposium Proceedings, 1988, ESD Association, Rome, NY
  • “Standardized Qualification and Verification Procedures for Electrostatic Discharge (ESD) Protective Materials,” Adrienne R. Kudlich, et al, EOS/ESD Symposium Proceedings, 1988, ESD Association, Rome, NY.
  • “Modular ESD Certification Training Program,” M. Berkowitz, B. Hamel, EOS/ESD Symposium Proceedings, 1989, ESD Association, Rome, NY
  • “Tracking Results of an ESD Control Program Within a Telecommunications Service Company,” R. J. Zezulka, EOS/ESD Symposium Proceedings, 1989, ESD Association, Rome, NY
  • “Development of a Corporate Standardization Program for ESD Control Materials and Products at Hughes Aircraft Company and Delco Electronics,” J. L. Joyce, R. L. Johnson, EOS/ESD Symposium Proceedings, 1991, ESD Association, Rome, NY.
  • “Implementation of Computer-Based ESD Training: A Case Study Comparing the Computer Approach with Traditional Classroom Techniques,” J. Woodward-Jack, H. Sommerfeld, EOS/ESD Symposium Proceedings, 1991, ESD Association, Rome, NY
  • “A Systematic ESD Program Revisited,” G. T. Dangelmayer, EOS/ESD Symposium Proceedings, 1992, ESD Association, Rome, NY
  • “You’ve Implemented An ESD Program –­ What’s Next?” W. Y. McFarland, R. A. Brin, EOS/ESD Symposium Proceedings, 1993, >ESD Association, Rome, NY
  • “A Successful ESD Training Program,” L. Snow, G. T. Dangelmayer, EOS/ESD Symposium Proceedings, 1994, ESD Association, Rome, NY
  • “Implementing an ESD Program in a Multi-National Company: A Cross-Cultural Experience,” W. H. Tan, EOS/ESD Symposium Proceedings, 1994, ESD Association, Rome, NY
  •  “Effectiveness of ESD Training Using Multimedia,” G. Smalanskas, J. Mason, EOS/ESD Symposium Proceedings, 1995,ESD Association, Rome, NY
  •  “ESD Demonstrations to Increase Engineering and Manufacturing Awareness,” G. Baumgartner, EOS/ESD Symposium Proceedings, 1996, ESD Association, Rome, NY
  • “ESD Program Auditing: The Auditor’s Perspective,” T.L. Theis, et al, EOS/ESD Symposium Proceedings, 1997, ESD Association, Rome, NY
  • “Procedures For The Design, Analysis and Auditing of Static Control Flooring/Footwear Systems”, L. Fromm, et al, EOS/ESD Symposium Proceedings, 1997, ESD Association, Rome, NY
  • “Continuous Voltage Monitoring Techniques for Improved ESD Auditing,” A. Wallash, EOS/ESD Symposium Proceedings, 2003, ESD Association, Rome, NY
  • “A Comparison of High-Frequency Voltage, Current and Field Probes and Implications for ESD/EOS/EMI Auditing”, A. Wallash, V. Kraz, EOS/ESD Symposium Proceedings, 2007, ESD Association, Rome, NY
  • IEC 61340-5-1, ed. 1.0, “Electrostatics – Part 5.1: Protection of electronic devices from electrostatic phenomena – General requirements”, IEC, Geneva, Switzerland, 2007-08.

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Fundamentals of Electrostatic Discharge
Part Three—Basic ESD Control Procedures and Materials
© 2014, EOS/ESD Association, Inc., Rome, NY

In Part Two, Principles of ESD Control – ESD Control Program Development, we introduced six principles of static control and six key elements of ESD program development and implementation. In Part Three, we will cover basic static control procedures and materials that will become part of your ESD control program. First, we review the principles. Basic Principles of Static Control We suggested focusing on just six basic principles in the development and implementation of effective ESD control programs:

  1. Design in protection by designing products and assemblies to be as robust as reasonable from the effects of ESD.
  2. Define the level of control needed in your environment.
  3. Identify and define the electrostatic protected areas (EPAs), the areas in which you will be handling ESD sensitive parts (ESDS).
  4. Reduce Electrostatic charge generation by reducing and eliminating static generating processes, keeping processes and materials at the same electrostatic potential, and by providing appropriate ground paths to reduce charge generation and accumulation.
  5. Dissipate and neutralize by grounding, ionization, and the use of conductive and dissipative static control materials.
  6. Protect products from ESD with proper grounding or shunting and the use of static control packaging and material handling products.

At the facility level our ESD control efforts concentrate on the last five principles. Here in Part Three, we will concentrate on the primary materials and procedures that reduce electrostatic charge generation, remove charges to ground, and neutralize charges to protect sensitive products from ESD.

Identifying the Problem Areas and the Level of Control One of the first questions we need to answer is “How ESD sensitive are the parts and assemblies we are manufacturing or handling?” This information will guide you in determining the various procedures and materials required to control ESD in your environment. How do you determine the sensitivity of your parts and assemblies or where can you get information about their ESD classification or withstand voltage?

A first source would be the manufacturer or supplier of the component itself or the part data sheet. It is critical that you obtain both Human Body Model (HBM) and Charged Device Model (CDM) ratings. You may find that you need to have your specific device tested for ESD sensitivity.  However, be aware that the correlation between voltages used for device qualification and static voltages measured in the field is weak.

The second question you need to answer is “Which areas of our facility need ESD protection?” This will allow you to define your specific electrostatic protected areas (EPAs), the areas in which you will be handling sensitive parts and the areas in which you will need to implement the ESD control principles. Often you will find that there are more areas that require protection than you originally thought, usually wherever ESDS devices are handled. Typical areas requiring ESD protection are shown in Table 1.

Table 1
Typical Facility Areas Requiring ESD Protection

Receiving
Inspection
Stores and warehouses
Assembly
Test and inspection
Research and development
Packaging
Field service repair
Offices and laboratories
Cleanrooms

Grounding

fundamentalsP3 clip image002

Figure 1: Common Point Ground Symbol

Grounding is especially important for effective ESD control It should be clearly defined, and regularly evaluated.

The equipment grounding conductor provides a path to bring ESD protective materials and personnel to the same electrical potential. All conductors and dissipative materials in the environment, including personnel, must be bonded or electrically connected and attached to a known ground, or create an equipotential balance between all items and personnel. ESD protection can be maintained at a charge or potential above a “zero” voltage ground reference as long as all items in the system are at the same potential. It is important to note that insulators, by definition non-conductors, cannot lose their electrostatic charge by attachment to ground.

ESD Association Standard ANSI/ESD S6.1-Grounding recommends a two-step procedure for grounding EPA ESD control items. The first step is to ground all components of the workstation and the personnel (worksurfaces, equipment, etc.) to the same electrical ground point, called the “common point ground.” This common point ground is defined as a “system or method for connecting two or more grounding conductors to the same electrical potential.”

This ESD common point ground should be properly identified. ESD Association standard ANSI/ESD S8.1 – Symbols, recommends the use of the symbol in Figure 1 to identify the common point ground.

The second step is to connect the common point ground to the equipment grounding conductor (AC ground) or the third wire (typically green) electrical ground connection. This is the preferred ground connection because all electrical equipment at the workstation is already connected to this ground. Connecting the ESD control materials or equipment to the equipment ground brings all components of the workstation to the same electrical potential.

If a soldering iron used to repair an ESDS item were connected to the electrical ground and the surface containing the ESDS item were connected to an auxiliary ground, a difference in electrical potential could exist between the iron and the ESDS item. This difference in potential could cause damage to the item. Any auxiliary ground (water pipe, building frame, ground stake) present and used at the workstation must be bonded to the equipment grounding conductor to minimize differences in potential between the two grounds.

Detailed information on ESD grounding can be found in ESD Association standard ANSI/ESD S6.1, Grounding, and the ESD Handbook ESD TR20.20, and/or CLC/TR 61340-5-2 User guide.

Controlling Static on Personnel and Moving Equipment

People can be one of the prime generators of static electricity. The simple act of walking around or the motions required in repairing a circuit board can generate several thousand volts of electrostatic charge on the human body. If not properly controlled, this static charge can easily discharge into an ESD sensitive device¬ – a typical Human Body Model discharge. Also, a person can transfer charge to a circuit board or other item making it vulnerable to Charged Device Model events in a subsequent process.

Even in highly automated assembly and test processes, people still handle ESDS … in the warehouse, in repair, in the lab, in transport. For this reason, ESD control programs place considerable emphasis on controlling personnel generated electrostatic discharge. Similarly, the movement of mobile equipment (such as carts or trolleys) and other wheeled equipment through the facility also can generate substantial static charges that can transfer to the products being transported on this equipment.

Wrist Straps

Typically, wrist straps are the primary means of grounding personnel. When properly worn and connected to ground, a wrist strap keeps the person wearing it near ground potential. Because the person and other grounded objects in the work area are at or near the same potential, there can be no hazardous discharge between them. In addition, static charges are removed from the person to ground and do not accumulate. When personnel are seated on a chair which is not EPA appropriate, they are to be grounded using a wrist strap.

Wrist straps have two major components, the wristband that goes around the person’s wrist and the ground cord that connects the wristband to the common point ground. Most wrist straps have a current limiting resistor molded into the ground cord on the end that connects to the wristband. This resistor is most commonly one megohm, rated at least 1/4 watt with a working voltage rating of 250 volts.

Wrist straps have several failure mechanisms and therefore should be tested on a regular basis. Either daily testing at specific test stations or using a continuous monitor at the workbench is recommended.

Floors, Floor Mats, Floor Finishes

A second method of grounding personnel is a Flooring/Footwear System using ESD flooring in conjunction with ESD control footwear or foot grounders. This combination of conductive or dissipative floor materials and footwear provides a safe ground path for the dissipation of electrostatic charge, thus reducing the charge accumulation on personnel. In addition to dissipating charge, some floor materials (and floor finishes) also reduce triboelectric charging. The use of a Flooring/Footwear System is especially appropriate in those areas where increased personnel mobility is necessary. In addition, floor materials can minimize charge accumulation on chairs, mobile equipment (such as carts and trolleys), lift trucks and other objects that move across the floor. However, those items require dissipative or conductive casters or wheels to make electrical contact with the floor, and components to be electrically connected. When used as the personnel grounding system, the resistance to ground including the person, footwear and floor must be the same as specified for wrist straps (<35 megohms) and the accumulation body voltage in a standard walking voltage test (ANSI/ESD STM97.2) must be less than 100 volts.

Shoes, Grounders, Casters

Used in combination with ESD flooring, static control shoes, foot grounders, casters and wheels provide the necessary electrical contact between the person or object and the flooring. Insulative footwear, casters, or wheels prevent static charges from flowing from the body or mobile equipment to the floor to ground and, therefore, have to be avoided.

Clothing

Clothing is a consideration in some ESD protective areas, especially in cleanrooms and very dry environments. Clothing materials, particularly those made of synthetic fabrics, can generate electrostatic charges that may discharge into ESDS or they may create electrostatic fields that may induce charges. Because clothing usually is electrically insulated or isolated from the body, charges on clothing fabrics are not necessarily dissipated to the skin and then to ground. Static control garments may suppress or otherwise affect an electric field from clothing worn underneath the garment. Per ANSI/ESD S20.20 and the Garment standard ANSI/ESD STM2.1, there are three categories of ESD garment:

  • ESD Category 1 garment; a static control garment without being attached to ground. However, without grounding, a charge may accumulate on conductive or dissipative elements of a garment, if present, resulting in a charged source.
  • ESD Category 2 garment; a groundable static control garment, when connected to ground, provides a higher level of suppression of the affects of an electric field from clothing worn underneath the garment.
  • ESD Category 3 garment; a groundable static control garment system also bonds the skin of the person to an identified ground path. The total system resistance including the person, garment and grounding cord shall be less than 35 megohms.

Workstations and Worksurfaces

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Figure 2: Typical ESD Workstation

An ESD protective workstation refers to the work area of a single individual that is constructed and equipped with materials and equipment to limit damage to ESD sensitive items. It may be a stand-alone station in a stockroom, warehouse, or assembly area, or in a field location such as a computer bay in commercial aircraft. A workstation also may be located in a controlled area such as a cleanroom. The key ESD control elements comprising most workstations are a static dissipative worksurface, a means of grounding personnel (usually a wrist strap), a common point ground, and appropriate signage and labeling. A typical workstation is shown in Figure 1.

The workstation provides a means for connecting all worksurfaces, fixtures, handling equipment, and grounding devices to a common point ground. In addition, there may be provision for connecting additional personnel grounding devices, equipment, and accessories such as constant or continuous monitors and ionizers.

Static protective worksurfaces with a resistance to ground of 1 megohm to 1 gigohm provide a surface that is at the same electrical potential as other ESD control items at the workstation. They also provide an electrical path to ground for the controlled dissipation of any static charges on materials that contact the surface. The worksurface also helps define a specific work area in which ESDS are to be handled. The worksurface is connected to the common point ground.

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Continuous or Constant Monitors

Continuous (or constant) monitors are designed to provide ongoing testing of the wrist strap system. While a number of technologies are utilized, the goal remains consistent: electrical connections are tested between the ground point, ground cord, wristband and person’s body while the wearer handles ESDS. Continuous monitors may also provide a monitoring circuit for the ESD worksurface or other equipment connection to the ground reference.

Typical test programs recommend that wrist straps that are used daily should be tested daily. However, if the products that are being produced are of such value that knowledge of a continuous, reliable ground is needed, and then continuous monitoring should be considered or even required. Daily wrist strap testing may be omitted if continuous monitoring is used.

Production Equipment and Production Aids

Although personnel can be the prime generator of electrostatic charge, automated manufacturing and test equipment also can pose an ESD problem. For example, an ESDS device may become charged from sliding down a component part feeder. If the device then contacts the insertion head or another conductive surface, a rapid discharge occurs from the device to the metal object — a Charged Device Model (CDM) event. If charging of the ESDS cannot be avoided – which is quite often the case in modern assembly lines due to the insulative IC packages – charge storage should be reduced by the use of ionizers. In addition, various production aids such as hand tools, tapes, or solvents can also be ESD concerns.

Grounding is the primary means of controlling static charge on equipment and many production aids. Much electrical equipment is required by the National Electrical Code to be connected to the equipment ground (the green wire) in order to carry fault currents. This ground connection also will function for ESD control purposes. All electrical tools and equipment used to process ESD sensitive hardware require the 3 prong grounded type AC plug. Hand tools that are not electrically powered, i.e., pliers, wire cutters, and tweezers, are usually grounded through the ESD worksurface and the grounded person using the conductive/dissipative tools. Holding fixtures should be made of conductive or static dissipative materials when possible. Static dissipative materials are often suggested when very sensitive devices are being handled. A separate ground wire may be required for conductive or dissipative fixtures not in contact with an ESD worksurface or handled by a grounded person. For those items that are composed of insulative materials, the use of ionization or application of topical antistats may be required to control electrostatic charge generation and accumulation of static charges.

Gloves and Finger Cots

Certainly, grounded personnel handling ESDS should not be wearing gloves or finger cots made from insulative material. If gloves or finger cots are used, the material should be dissipative or conductive.

Compliance Verification ESD TR53 provides test procedures for measuring the electrical resistance of gloves or finger cots together with personnel in a system.

Packaging and Handling

Inside the EPA packaging and material handing containers are to be low charging and be dissipative or conductive. Outside the EPA packaging and material handing containers are to also have a structure that provides electrostatic discharge shielding.

Direct protection of ESDS devices from electrostatic discharge is provided by packaging materials such as shielding bags, corrugated boxes, and rigid or semi-rigid plastic packages. The primary use of these items is to protect the product when it leaves the facility, usually when shipped to a customer. In addition, materials handling products such as tote boxes and other containers primarily provide protection during inter- or intra-facility transport.

The main ESD function of these packaging and materials handling products is to limit the possible impact of ESD from triboelectric charge generation, direct discharge, and in some cases electrostatic fields. The initial consideration is to have low charging materials in contact with ESD sensitive items. For example, the low charging property would control triboelectric charge resulting from sliding a board or component into the package or container. A second requirement is that the material can be grounded so that the resistance range must be conductive or dissipative. A third property required outside the EPA is to provide protection from direct electrostatic discharges that is discharge shielding.

Many materials are available that provide all three properties: low charging, resistance, and discharge shielding. The inside of these packaging materials have a low charging layer, but also have an outer layer with a surface resistance conductive or dissipative range. Per the Packaging standard ANSI/ESD S541, a low-charging, conductive or dissipative package is required for packaging or material handling within an EPA. Outside the EPA, the packaging must also have the discharge shielding property. Effectiveness, cost and device vulnerability to the various mechanisms need to be balanced in making packaging decisions (see ANSI/ESD S541, the ESD Handbook ESD TR20.20, and/or CLC/TR 61340-5-2 User guide for more detailed information).

Resistance or resistivity measurements help define the material’s ability to provide electrostatic shielding or charge dissipation. Electrostatic shielding attenuates electrostatic fields on the surface of a package in order to prevent a difference in electrical potential from existing inside the package. Discharge shielding is provided by materials that have a surface resistance equal to or less than 1 kilohm when tested according to ANSI/ESD STM11.11 or a volume resistivity of equal to or less than 1 × 10­ ohm-cm when tested according to the methods of ANSI/ESD STM11.12. In addition, effective shielding may be provided by packaging materials that provide a sufficiently large air gap between the package and the ESDS contents. Dissipative materials provide charge dissipation characteristics. These materials have a surface resistance greater than 10 kilohms but less than 100 gigohms when tested according to ANSI/ESD STM11.11 or a volume resistivity greater than 1.0 × 105 ohm-cm but less than or equal to 1.0 × 1012 ohm-cm when tested according to the methods of ANSI/ESD STM11.12. The ability of some packages to provide discharge shielding may be evaluated using ANSI/ESD STM11.31 which measures the energy transferred to the package interior. A material’s low charging properties are not necessarily predicted by its resistance or resistivity.

Ionization

Most static control programs also deal with isolated conductors that are not grounded, or insulating materials (e.g., most common plastics) that cannot be grounded. Topical antistats may provide temporary ability to dissipate static charges under some circumstances.

More frequently, however, air ionization is used to neutralize the static charge on insulated and isolated objects by producing a balanced source of positively and negatively charged ions. Whatever static charge is present on objects in the work environment will be reduced, neutralized by attracting opposite polarity charges from the air. Because it uses only the air that is already present in the work environment, air ionization may be employed even in cleanrooms where chemical sprays and some static dissipative materials are not usable.

Air ionization is one component of a complete ESD control program, and not a substitute for grounding or other methods. Ionizers are used when it is not possible to properly ground everything and as backup to other static control methods. In cleanrooms, air ionization may be one of the few methods of static control available.

See Ionization standard ANSI/ESD STM3.1, ANSI/ESD SP3.3, and ESD TR53 for testing offset voltage (balance) and discharge times of ionizers.

Cleanrooms

While the basic methods of static control discussed here are applicable in most environments, cleanroom manufacturing processes require special considerations.

Many objects integral to the semiconductor manufacturing process (quartz, glass, plastic, and ceramic) are inherently charge generating. Because these materials are insulators, this charge cannot be removed by grounding. Many static control materials contain carbon particles or surfactant additives that sometimes restrict their use in cleanrooms. The need for personnel mobility and the use of cleanroom garments often make the use of wrist straps difficult. In these circumstances, ionization and flooring/footwear grounding systems become key weapons against static charge.

Identification

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Figure 3: ESD Susceptibility Symbol

A final element in our ESD control program is the use of appropriate symbols to identify ESD sensitive items, as well as specialty products intended to control ESD. The two most widely accepted symbols for identifying ESDS parts or ESD control protective materials are defined in ESD Association Standard ANSI/ESD S8.1 — ESD Awareness Symbols.

 

The ESD Susceptibility Symbol (Figure 3) consists of a triangle, a reaching hand, and a slash through the reaching hand. The triangle means “caution” and the slash through the reaching hand means “Don’t touch.” Because of its broad usage, the hand in the triangle has become associated with ESD and the symbol literally translates to “ESD sensitive stuff, don’t touch.”

The ESD Susceptibility Symbol is applied directly to integrated circuits, boards, and assemblies that are ESD sensitive. It indicates that handling or use of this item may result in damage from ESD if proper precautions are not taken. Operators should be grounded prior to handling. If desired, the sensitivity level of the item may be added to the label.

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Figure 4: ESD Protective Symbol

The ESD Protective Symbol (Figure 4) consists of the reaching hand in the triangle. An arc around the triangle replaces the slash. This “umbrella” means protection. The symbol indicates ESD protective material. It is applied to mats, chairs, wrist straps, garments, packaging, and other items that provide ESD protection. It also may be used on equipment such as hand tools, conveyor belts, or automated handlers that is especially designed or modified to provide ESD control properties (low charging, conductive/dissipative resistance, and/or discharge shielding).

Summary

Effective ESD control programs require a variety of procedures and materials. The ESD coordinator should release and control regularly a list of the specific EPA ESD control products permitted to be used in the program. We have provided a brief overview of the most commonly used products. Additional in-depth discussion of individual materials and procedures can be found in publications such as the ESD Handbook (ESD TR20.20) published by the ESD Association or the CLC/TR 61340-5-2 User guide.

Your program is up and running. How do you determine whether it is effective? How do you make sure your employees follow it? In Part Four, we will cover the topics of Auditing and Training.

For Additional Information
ESD Association Standards

  • ANSI/ESD S1.1: Wrist Straps, ESD Association, Rome, NY 13440
  • ANSI/ESD STM2.1: Garments-Characterization, ESD Association, Rome, NY 13440
  • ANSI/ESD STM3.1: Ionization, ESD Association, Rome, NY 13440
  • ANSI/ESD SP3.3: Periodic Verification of Air Ionizers, ESD Association, Rome, NY 13440
  • ANSI/ESD S4.1: Worksurfaces-Resistance Measurements, ESD Association, Rome, NY 13440
  • ANSI/ESD STM4.2: ESD Protective Worksurfaces – Charge Dissipation Characteristics, ESD Association, Rome, NY 13440
  • ANSI/ESD S6.1: Grounding, ESD Association, Rome, NY 13440
  • ANSI/ESD S7.1: Resistive Characterization of Materials-Floor Materials, ESD Association, Rome, NY 13440
  • ANSI/ESD S8.1: Symbols-ESD Awareness, ESD Association, Rome, NY 13440
  • ANSI/ESD STM9.1: Footwear-Resistive Characterization, ESD Association, Rome, NY 13440
  • ESD SP9.2: Footwear-Foot Grounders Resistive Characterization, ESD Association, Rome, NY 13440
  • ANSI/ESD SP10.1: Automated Handling Equipment, ESD Association, Rome, NY 13440
  • ANSI/ESD STM11.11: Surface Resistance Measurement of Static Dissipative Planar Materials, ESD Association, Rome, NY 13440
  • ANSI/ESD STM11.12: Volume Resistance Measurement of Static Dissipative Planar Materials, ESD Association, Rome, NY 13440
  • ANSI/ESD STM11.13: Two-Point Resistance Measurement, ESD Association, Rome, NY 13440
  • ANSI/ESD STM11.31: Evaluating the Performance of Electrostatic Discharge Shielding Bags, ESD Association, Rome, NY 13440
  • ANSI/ESD STM12.1: Seating-Resistive Measurement, ESD Association, Rome, NY 13440
  • ESD STM13.1: Electrical Soldering/Desoldering Hand Tools, ESD Association, Rome, NY 13440
  • ANSI/ESD SP15.1: In-Use Resistance Testing of Gloves and Finger Cots, ESD Association, Rome, NY 13440
  • ANSI/ESD S20.20: Standard for the Development of an ESD Control Program, ESD Association, Rome, NY 13440
  • ANSI/ESD STM97.1: Floor Materials and Footwear – Resistance in Combination with a Person, ESD Association, Rome, NY 13440
  • ANSI/ESD STM97.2: Floor Materials and Footwear – Voltage Measurement in Combination with a Person, ESD Association, Rome, NY 13440
  • ANSI/ESD S541: Packaging Materials for ESD Sensitive Devices, ESD Association, Rome, NY 13440
  • ESD ADV1.0: Glossary of Terms, ESD Association, Rome, NY 13440
  • ESD ADV11.2: Triboelectric Charge Accumulation Testing, ESD Association, Rome, NY 13440
  • ESD ADV53.1: ESD Protective Workstations, ESD Association, Rome, NY 13440
  • ESD TR20.20: ESD Handbook, ESD Association, Rome, NY 13440
  • ESD TR53: Compliance Verification of ESD Protective Equipment and Materials, ESD Association, Rome, NY 13440

Other Resources

System Reliability Center, 201 Mill Street, Rome, NY 13440
ANSI/IEEE STD142, IEEE Green Book, Institute of Electrical and Electronics Engineers
ANSI/NFPA 70, National Electrical Code, National Fire Protection Association, Quincy, MA

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Fundamentals of Electrostatic Discharge
Part Two – Principles of ESD Control – ESD Control Program Development
© 2013, EOS/ESD Association, Inc., Rome, NY

In Part One of this series, Introduction to ESD, we discussed the basics of electrostatic charge and discharge, the mechanisms of creating charge, materials, types of ESD damage, ESD events, and ESD sensitivity. We concluded our discussion with the following summary:

  1. Virtually all materials, including conductors, can be triboelectrically charged.
  2. The amount of charge is affected by material type, speed of contact and separation, humidity, and several other factors.
  3. Charged objects have electrostatic fields.
  4. Electrostatic discharge can damage devices so a parameter fails immediately, or ESD damage may be a latent defect that may escape mediate detection, but may cause the device to fail prematurely.
  5. Electrostatic discharge can occur throughout the manufacturing, test, shipping, handling, or operational processes, and during field service operations.
  6. ESD damage can occur as the result of a discharge to the device, from the device, or from charge transfers resulting from electrostatic fields. Devices vary significantly in their sensitivity or susceptibility to ESD.

Protecting products from the effects of ESD damage begins by understanding these key concepts of electrostatic charges and discharges. An effective ESD control program requires an effective training program where all personnel involved understand the key concepts. Armed with this information, you can then begin to develop an effective ESD control program. In Part Two we will focus on some basic principles of ESD control and ESD control program development.
Basic Principles of Static Control

Controlling electrostatic discharge (ESD) in the electronics manufacturing environment is a formidable challenge. However, the task of designing and implementing ESD control programs becomes less complex if we focus on just six basic principles of static control. In doing so, we also need to keep in mind the ESD corollary to Murphy’s law, “no matter what we do, static charge will try to find a way to discharge.”

1. Design In Protection

The first principle is to design products and assemblies to be as resistant as reasonable from the effects of ESD. This involves such steps as using less static sensitive devices or providing appropriate input protection on devices, boards, assemblies, and equipment. For engineers and designers, the paradox is that advancing product technology requires smaller and more complex geometries that often are more susceptible to ESD. The Industry Council on ESD Target Levels and the ESD Association’s “Electrostatic Discharge (ESD) Technology Roadmap”, revised April 2010, suggest that designers will have less ability to provide the protection levels that were available in the past. Consequently, the ESD target levels are reduced to 1000 volts for Human Body Model robustness and 250 volts for robustness against the Charged Device Model, with tendency to reduce these values further. Those target values are considered to be realistic and safe levels for manufacturing and handling of today’s products using basic ESD control methods as described in international industry standards as e.g. ANSI/ESD S20.20 or IEC 61340-5-1. When devices with lower ESD target levels must be used and handled, application-specific controls beyond the principles described here may be required.

2. Define the Level of Control Needed in Your Environment.

What is the most sensitive or ESD susceptible ESDS you are using and what is the classification of withstand voltage of the products that you are manufacturing and shipping? In order to get an idea of what is required, it is best to know the Human-Body Model (HBM) and Charged-Device Model (CDM) sensitivity levels for all devices that will be handled in the manufacturing environment. ANSI/ESD S20.20 and IEC 61350-5-1, both published in 2007,  define control program requirements for items that are sensitive to 100 volts HBM; future version of those standards will most likely address also items that are sensitive to 200 volts CDM.  With documentation, both standards allows requirements to be tailored as appropriate for specific situations.

3.  Identify and Define the Electrostatic Protected Areas (EPA).

Per Glossary ESD ADV1.0 an ESD protected area is “A defined location with the necessary materials, tools and equipment capable of controlling static electricity to a level that minimizes damage to ESD susceptible items”. These are the areas in which you will be handling ESD sensitive items and the areas in which you will need to implement the basic ESD control procedures including bonding or electrically connecting all conductive and dissipative materials, including personnel, to a known common ground.

4.  Reduce Electrostatic Charge Generation

If projections of ESD sensitivity are correct, ESD protection measures in product design will be increasingly less effective in minimizing ESD losses. The fourth principle of control is to reduce electrostatic charge generation and accumulation in the first place. It’s fairly basic: no charge – no discharge. We begin by eliminating as many static charge generating processes or materials, specifically high-charging insulators such as common plastics, as possible from the EPA work environment. We keep conductive/dissipative materials at the same electrostatic potential using equipotential bonding or attaching to equipment ground. Electrostatic discharge does not occur between materials kept at the same potential. In the EPA, ESD control items should be used in place of more common factory products such as worksurface mats, flooring, smocks, etc. which are to be attached to ground to reduce charge generation and accumulation. Personnel are grounded via wrist straps or a flooring/footwear system. While the basic principle of “controlling static electricity to a level that minimizes damage” should be followed, complete removal of charge generation is not achievable.

5.  Dissipate and Neutralize

Because we simply can’t eliminate all generation of electrostatic charge in the EPA, our fifth principle is to safely dissipate or neutralize those electrostatic charges that do occur. Proper grounding and the use of conductive or dissipative materials play major roles. For example, personnel starting work may have a charge on their body; they can have that charge removed by attachment to a wrist strap or when they step on ESD flooring while wearing ESD control footwear. The charge goes to ground rather than being discharged into a sensitive part. To prevent damaging a charged device, the magnitude of the discharge current can be controlled with static dissipative materials.

For some objects, such as common plastics and other insulators, being non-conductors grounding cannot remove an electrostatic charge because there is no pathway which is conductive enough to reduce the charge in a reasonable time. If the object cannot be eliminated from the EPA, ionization can be used to neutralize charges on these insulators. The ionization process generates negative and positive ions. The like charged ions are repelled from a charged object while the opposite charged ions are attracted to the surface of a charged object, therefore neutralizing the object (see Figure 1). If the ionizer is balanced, the net charge is zero.

6. Protect Products

Our final ESD control principle is to prevent discharges that do occur from reaching susceptible parts and assemblies. There are a variety of ESD control packaging and material handling products to use both inside and outside the EPA. One way is to protect ESD sensitive products and assemblies with proper grounding or shunting that will “dissipate” any discharge away from the product. A second method is to package, to store, or to transport ESD sensitive products in packaging that is low charging and are conductive/dissipative so can remove charges when grounded. In addition to these properties, packaging used to move ESD sensitive items outside the EPA should have the ESD control property of “discharge shielding”. These materials should effectively shield the product from charges and discharges, as well as reduce the generation of charge caused by any movement of product within the container.

Elements of an Effective ESD Control Program

While these six principles may seem rather basic, they can guide us in the selection of appropriate materials and procedures to use in effectively controlling ESD. In most circumstances, effective programs will involve all of these principles. No single procedure or product will do the whole job; rather effective static control requires a full ESD control program.

How to we develop and maintain a program that puts these basic principles into practice? How do we start? What is the process? What do we do first? Ask a dozen experts and you may get a dozen different answers. But, if you dig a little deeper, you will find that most of the answers center on similar key elements. You will also find that starting and maintaining an ESD control program is similar to many other business activities and projects. Although each company is unique in terms of its ESD control needs, there are at least 6 critical elements to successfully developing, implementing, and maintaining an effective ESD control program (see Figure 2).

1.  Establish an ESD Coordinator and ESD Teams

A team approach particularly applies to ESD because the problems and the solutions cross various functions, departments, divisions and suppliers in most companies. ESD team composition includes line employees as well as department heads or other management personnel. The ESD team may also cut across functions such as incoming inspection, quality, training, automation, packaging, and test. ESD teams or committees help assure a variety of viewpoints, the availability of the needed expertise, and commitment to success. An active ESD team helps unify the ongoing effort.

Heading this ESD team effort is an ESD program coordinator (“ESD coordinator”). Ideally, this responsibility should be a full-time job. However, we seldom operate in an ideal environment and you may have to settle for the function to be a major responsibility of an individual. The ESD coordinator is responsible for developing, budgeting, and administering the program. The ESD coordinator also serves as the company’s internal ESD consultant to all ESD control programs areas.

2.  Assess Your Organization, Facility, Processes and Losses

Your next step is to gain a thorough understanding of your environment and its impact on ESD. Armed with your product quality loss and ESD sensitivity data, you can evaluate your facility, looking for areas and procedures that may possibly cause ESD problems. Be on the lookout for things such as static generating materials, personnel handling procedures for ESD sensitive items, and contacts of ESD sensitive devices to conductors

Document your processes or work instructions. Observe the movement of people and materials through the areas. Note those areas that would appear to have the greatest potential for ESD problems. Remember, that ESD can occur in the warehouse just as it can in the assembly areas. Then conduct a thorough facility survey or audit. Measure personnel, equipment, and materials to identify proper resistance ranges and the presence of electrostatic fields in your environment.

Before seeking solutions to your problems, you will need to determine the extent of your product quality losses to ESD. These losses may be reflected in receiving reports, Quality Assurance and Quality Control records, customer returns, in-plant yields, failure analysis reports, and other data that you may already have or that you need to gather. This information not only identifies the magnitude of the problem, but also helps to pinpoint and prioritize areas that need attention. Where available, the potential for future problems as a result of technology roadmaps and internal product evolution should be considered.

Document your actual and potential ESD losses in terms of defective components, rework, customer returns, and failures during final test and inspection. Use data from outside sources or the results of your pilot program for additional support. Develop estimates of the savings to be realized from implementing an ESD control program.

You will also want to identify those items (components, assemblies, and finished products) that are the most sensitive to ESD noting the classification or withstand voltage. Note that two functionally identical items from two different suppliers may not have similar ESD ratings.

3.   Establish and Document Your ESD Control Program Plan

After completing your assessment, you can begin to develop and document your ESD control program plan. The plan should cover the scope of the program and include the tasks, activities and procedures necessary to protect the ESD sensitive items at or above the ESD sensitivity level chosen for the plan. Prepare and distribute written procedures and specifications so that all departments have a clear understanding of what is to be done. Fully documented procedures will help you meet the administrative and technical elements of ANSI/ESD S20.20 or IEC 61340-5-1 and help you with ISO 9000 certification as well

4.   Build Justification to Get the Top Management Support

To be successful, an ESD program requires the support of your top management, at the highest level possible. What level of commitment is required? To obtain commitment, you will need to build justification for the plan. You will need to emphasize quality and reliability, the costs of ESD damage, the impact of ESD on customer service and product performance. It may be useful to conduct a pilot program if the experience of other companies is not sufficient and you have an expectation that you can show meaningful results in the pilot.

Prepare a short corporate policy statement on ESD control. Have top management co-sign it with the ESD coordinator. Periodically, reaffirm the policy statement and management’s commitment to it. Published articles such as The “Real” Cost of ESD Damage by Terry Welsher should be provided to top management.

5. Develop and Implement a Training Plan

Train and retrain your personnel in ESD control and your company’s ESD control program and procedures. Training should include testing or other method to verify comprehension. Proper training for line personnel is especially important. They are often the ones who have to live with the procedures on a day-to-day basis. A sustained commitment and mindset among all employees that ESD prevention is a valuable, on-going effort by everyone is one of the primary goals of training. Please be aware that it might be necessary to tailor the ESD training to the education of the trainees.

ANSI/ESD S20.20 requires a written training plan, however, your company has the flexibility to determine how best to design the plan.

6. Develop and Implement a Compliance Verification Plan

Developing and implementing the program itself is obvious. What might not be so obvious is the need to continually review, audit, analyze, obtain feedback and improve. Auditing is essential to ensure that the ESD control program is successful. You will be asked to continually identify the return on investment of the program and to justify the savings realized. Technological changes will dictate improvements and modifications. Feedback to employees and top management is essential. Management commitment will need reinforcement.

Include both reporting and feedback to management, the ESD team, and other employees as part of your plan. Management will want to know that their investment in time and money is yielding a return in terms of quality, reliability and profits. ESD team members need a pat on the back for a job well done. Other employees will want to know that the procedures you have asked them to follow are indeed worthwhile. It is helpful to integrate the process improvement process into the overall quality system and use the existing quality tools such as root cause analysis and corrective action reports. As you find areas that need work, be sure to make the necessary adjustments to keep the program on track.

Conduct periodic evaluations of your program and audits of your facility. You will find out if your program is successful and is giving you the expected return. You will spot weaknesses in the program and shore them up. You will discover whether the procedures are being followed.

ANSI/ESD S20.20 and IEC 61340-5-1 require a written compliance verification plan, however, your company has the flexibility to determine how best to design the plan. Test procedures are described in ESD TR53-01-06 Compliance Verification of ESD Protective Equipment and Materials which is available as complimentary download from www.ESDA.org. The objective is to identify if significant changes in ESD equipment and materials performance have occurred over time. Each user will need to develop their own set of test frequencies based on the critical nature of those ESD sensitive items handled and the risk of failure for the ESD protective equipment and materials.

Conclusion

Six principles of ESD control and six key elements to ESD control program development and implementation are your guideposts for effective ESD control programs.

The six basic principles of static control are:

  1. Design in protection
  2. Define the level of control needed in your environment
  3. Identify and define the electrostatic protected areas (EPA)
  4. Reduce electrostatic charge generation
  5. Dissipate and neutralize
  6. Protect products

Six key elements to to ESD control program development and implementation are:

  1. Establish an ESD Coordinator and ESD teams
  2. Assess your organization, facility, processes and losses
  3. Establish and document your ESD control program plan
  4. Build justification to get the top management support
  5. Develop and implement a training plan
  6. Develop and implement a compliance verification plan

In Part Three, we’ll take a close look at specific procedures and materials that become part of your ESD control program.

For Additional Information

  • ANSI/ESD S20.20-2007 – Standard for the Development of Electrostatic Discharge Control Program, ESD Association, Rome, NY.
  • Dangelmayer, Theodore, ESD Program Management: A Realistic Approach to Continuous, Measurable Improvement in Static Control, 1999, Kluwer Academic Publishers, Boston, MA
  • ESD TR20.20, ESD Control Handbook, ESD Association, Rome, NY.
  • ESD TR53-01-06, Compliance Verification of ESD Protective Equipment and Materials, ESD Association, Rome, NY.
  • Industry Council on ESD Target Levels, White Paper I: “A Case for Lowering Component Level HBM/MM ESD Specifications and Requirements”, Revision 2.0, October 2010.
  • Industry Council on ESD Target Levels, White Paper II: “A Case for Lowering Component
  • Level CDM ESD Specifications and Requirements”, Revision 2.0, April 2010.
  • ESDA Technology Roadmap,  March 2013
  • IEC 61340-5-1, ed. 1.0, “Electrostatics – Part 5.1: Protection of electronic devices from electrostatic phenomena – General requirements”, IEC, Geneva, Switzerland, 2007-08.
  • Terry Welsher, The “Real” Cost of ESD Damage, InCompliance, May 01, 2010.
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Figure 1: Prinziple of neutralization of a charged object by an ionizer that generates negative and positive ions. The like charged ions are repelled from a charged object while the opposite charged ions are attracted to the surface of a charged object, neutralizing the object

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Figure 2: Six critical elements of a successful ESD control program

Download as a PDF »

Fundamentals of Electrostatic Discharge
Part One—An Introduction to ESD
© 2013, EOS/ESD Association, Inc., Rome, NY

History & Background

To many people, Electrostatic Discharge (ESD) is only experienced as a shock when touching a metal doorknob after walking across a carpeted floor or after sliding across a car seat. However, static electricity and ESD has been a serious industrial problem for centuries. As early as the 1400s, European and Caribbean military forts were using static control procedures and devices trying to prevent inadvertent electrostatic discharge ignition of gunpowder stores. By the 1860s, paper mills throughout the U.S. employed basic grounding, flame ionization techniques, and steam drums to dissipate static electricity from the paper web as it traveled through the drying process. Every imaginable business and industrial process has issues with electrostatic charge and discharge at one time or another. Munitions and explosives, petrochemical, pharmaceutical, agriculture, printing and graphic arts, textiles, painting, and plastics are just some of the industries where control of static electricity has significant importance. The age of electronics brought with it new problems associated with static electricity and electrostatic discharge. And, as electronic devices become faster and the circuitry getting smaller, their sensitivity to ESD in general increases. This trend may be accelerating. The ESD Association’s “Electrostatic Discharge (ESD) Technology Roadmap”, revised April 2010, includes “With devices becoming more sensitive through 2010-2015 and beyond, it is imperative that companies begin to scrutinize the ESD capabilities of their handling processes”. Today, ESD impacts productivity and product reliability in virtually every aspect of the global electronics environment.

Despite a great deal of effort during the past thirty years, ESD still affects production yields, manufacturing cost, product quality, product reliability, and profitability. The cost of damaged devices themselves ranges from only a few cents for a simple diode to thousands of dollars for complex integrated circuits. When associated costs of repair and rework, shipping, labor, and overhead are included, clearly the opportunities exist for significant improvements. Nearly all of the thousands of companies involved in electronics manufacturing today pay attention to the basic, industry accepted elements of static control. ESD Association industry standards are available today to guide manufacturers in establishing the fundamental static charge mitigation and control techniques (see Part Six – ESD Standards). It is unlikely that any company which ignores static control will be able to successfully manufacture and deliver undamaged electronic parts.

Static Electricity: Creating Charge

Definitions for Electrostatic Discharge Terminology are in the ESD ADV1.0 Glossary which is available as a complimentary download at www.ESDA.org. Electrostatic charge is defined as “electric charge at rest”. Static electricity is an imbalance of electrical charges within or on the surface of a material. This imbalance of electrons produces an electric field that can be measured and that can influence other objects. Electrostatic discharge (ESD) is defined as “the rapid, spontaneous transfer of electrostatic charge induced by a high electrostatic field. Note: Usually, the charge flows through a spark between two bodies at different electrostatic potentials as they approach one another”. Electrostatic discharge can change the electrical characteristics of a semiconductor device, degrading or destroying it. Electrostatic discharge also may upset the normal operation of an electronic system, causing equipment malfunction or failure. Charged surfaces can attract and hold contaminants, making removal of the particles difficult. When attracted to the surface of a silicon wafer or a device’s electrical circuitry, air-borne particulates can cause random wafer defects and reduce product yields.

Controlling electrostatic discharge begins with understanding how electrostatic charge occurs in the first place. Electrostatic charge is most commonly created by the contact and separation of two materials. The materials may be similar or dissimilar although dissimilar materials tend to liberate higher levels of static charge. For example, a person walking across the floor generates static electricity as shoe soles contact and then separate from the floor surface. An electronic device sliding into or out of a bag, magazine or tube generates an electrostatic charge as the device’s housing and metal leads make multiple contacts and separations with the surface of the container. While the magnitude of electrostatic charge may be different in these examples, static electricity is indeed formed in each case.

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Figure 1 The Triboelectric Charge. Materials Make Intimate Contact

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Figure 2 The Triboelectric Charge – Separation

Creating electrostatic charge by contact and separation of materials is known as “triboelectric charging.” The word “triboelectric” comes from the Greek words, tribo – meaning “to rub” and elektros – meaning “amber” (fossilized resin from prehistoric trees). It involves the transfer of electrons between materials. The atoms of a material with no static charge have an equal number of positive (+) protons in their nucleus and negative (-) electrons orbiting the nucleus. In Figure 1, Material “A” consists of atoms with equal numbers of protons and electrons. Material B also consists of atoms with equal (though perhaps different) numbers of protons and electrons. Both materials are electrically neutral.

When the two materials are placed in contact and then separated, negatively charged electrons are transferred from the surface of one material to the surface of the other material. Which material loses electrons and which gains electrons will depend on the nature of the two materials. The material that loses electrons becomes positively charged, while the material that gains electrons is negatively charged. This is shown in Figure 2.

Static electricity is measured in coulombs. The charge “q” on an object is determined by the product of the capacitance of the object “C” and the voltage potential on the object (V):
q = CV
Commonly, however, we speak of the electrostatic potential on an object, which is expressed as voltage.

This process of material contact, electron transfer and separation is a much more complex mechanism than described here. The amount of charge created by triboelectric generation is affected by the area of contact, the speed of separation, relative humidity, and chemistry of the materials, surface work function and other factors. Once the charge is created on a material, it becomes an electrostatic charge (if it remains on the material). This charge may be transferred from the material, creating an electrostatic discharge or ESD event. Additional factors, such as the resistance of the actual discharge circuit and the contact resistance at the interface between contacting surfaces also affect the actual charge that is released. Typical charge generation scenarios and the resulting voltage levels are shown in Table 1. In addition, the contribution of humidity to reducing charge accumulation is also shown. It should be noted however that static charge generation still occurs even at high relative humidity.

 

Table 1
Examples of Static Generation – Typical Voltage Levels
Means of Generation 10-25% RH 65-90% RH
Walking Across Carpet 35,000V 1,500V
Walking Across Vinyl Tile 12,000V 250V
Worker at a Bench 6,000V 100V
Poly Bag Picked up from Bench 20,000V 1,200V
Chair with Urethane Foam 18,000V 1,500V

An electric charge also may be created on a material in other ways such as by induction, ion bombardment, or contact with another charged object.  However, triboelectric charging is the most common.

How Material Characteristics Affect Static Charge

Triboelectric Series

When two materials contact and separate, the polarity and magnitude of the charge are indicated by the materials’ positions in a triboelectric series. The triboelectric series tables show how charges are generated on various materials. When two materials contact and separate, the one nearer the top of the series takes on a positive charge, the other a negative charge. Materials further apart on the table typically generate a higher charge than ones closer together. These tables, however, should only be used as a general guide because there are many variables involved that cannot be controlled well enough to ensure repeatability. A typical triboelectric series is shown in Table 2.

 

Table 2
Typical Triboelectric Series
Positive + Rabbit fur
Glass
Mica
Human Hair
Nylon
Wool
Fur
Lead
Silk
Aluminum
Negative – Paper
COTTON
Steel
Wood
Amber
Sealing Wax
Nickel, copper Brass, silver
Gold, platinum
Sulfur
Acetate rayon
Polyester
Celluloid
Silicon
Teflon

 

Virtually all materials, including water and dirt particles in the air, can be triboelectrically charged. How much charge is generated, where that charge goes, and how quickly, are functions of the material’s physical, chemical and electrical characteristics.
Insulative Materials

A material that prevents or limits the flow of electrons across its surface or through its volume is called an insulator. Insulators have an extremely high electrical resistance, insulative materials are defined as “materials with a surface resistance or a volume resistance equal to or greater than 1 × 1011 ohms.” A considerable amount of charge can be generated on the surface of an insulator. Because an insulative material does not readily allow the flow of electrons, both positive and negative charges can reside on insulative surface at the same time, although at different locations. The excess electrons at the negatively charged spot might be sufficient to satisfy the absence of electrons at the positively charged spot. However, electrons cannot easily flow across the insulative material’s surface, and both charges may remain in place for a very long time.

Conductive Materials

A conductive material, because it has low electrical resistance, allows electrons to flow easily across its surface or through its volume. Conductive materials have low electrical resistance, less than 1 × 104 ohms (surface resistance) and 1 × 104 ohm (volume resistance) per Glossary ESD ADV1.0. When a conductive material becomes charged, the charge (i.e., the deficiency or excess of electrons) will be uniformly distributed across the surface of the material. If the charged conductive material makes contact with another conductive material, the electrons will be shared between the materials quite easily. If the second conductor is attached to AC equipment ground or any other grounding point, the electrons will flow to ground and the excess charge on the conductor will be neutralized.

Electrostatic charge can be created triboelectrically on conductors the same way it is created on insulators. As long as the conductor is isolated from other conductors or ground, the static charge will remain on the conductor. If the conductor is grounded the charge will easily go to ground. Or, if the charged conductor contacts another conductor, the charge will flow between the two conductors.

Static Dissipative Materials

Static dissipative materials have an electrical resistance between insulative and conductive materials (1 × 104 < 1 × 1011 ohms surface or volume resistance). There can be electron flow across or through the dissipative material, but it is controlled by the surface resistance or volume resistance of the material.

As with the other two types of materials, charge can be generated triboelectrically on a static dissipative material. However, like the conductive material, the static dissipative material will allow the transfer of charge to ground or other conductive objects. The transfer of charge from a static dissipative material will generally take longer than from a conductive material of equivalent size. Charge transfers from static dissipative materials are significantly faster than from insulators, and slower than from conductive material.

Electrostatic Fields

Charged materials also have an electrostatic field and lines of force associated with them. Conductive objects brought into the vicinity of this electric field will be polarized by a process known as induction Figure 3. A negative electric field will repel electrons on the surface of the conducting item that is exposed to the field. A positive electric field will attract electrons to near the surface thus leaving other areas positively charged. No change in the actual charge on the item will occur in polarization. If, however, the item is conductive or dissipative and is connected to ground while polarized, the charge will flow from or to ground due to the charge imbalance. If the electrostatic field is removed and the ground contact disconnected, the charge will remain on the item. If a nonconductive object is brought into the electric field, the electrical dipoles will tend to align with the field creating apparent surface charges. A nonconductor (insulative material) cannot be charged by induction.

figure1Induction

Figure 3 Induction

ESD Damage—How Devices Fail

Electrostatic damage is defined as “change to an item caused by an electrostatic discharge that makes it fail to meet one or more specified parameters.” and can occur at any point from manufacture to field service. Typically, damage results from handling the devices in uncontrolled surroundings or when poor ESD control practices are used. Generally damage is classified as either a catastrophic failure or a latent defect.
Catastrophic Failure

When an electronic device is exposed to an ESD event, it may no longer function. The ESD event may have caused a metal melt, junction breakdown, or oxide failure. The device’s circuitry is permanently damaged causing the device to stop functioning totally or at least partially. Such failures usually can be detected when the device is tested before shipment. If a damaging level ESD event occurs after test, the part may go into production and the damage will go undetected until the device fails in final test.

Latent Defect

Per ESD ADV1.0 latent failure is “a malfunction that occurs following a period of normal operation. The failure may be attributable to an earlier electrostatic discharge event. The concept of latent failure is controversial and not totally accepted by all in the technical community.” A latent defect is difficult to identify. A device that is exposed to an ESD event may be partially degraded, yet continue to perform its intended function. However, the operating life of the device may be reduced. A product or system incorporating devices with latent defects may experience premature failure after the user places them in service. Such failures are usually costly to repair and in some applications may create personnel hazards.

It is relatively easy with the proper equipment to confirm that a device has experienced a catastrophic failure. Basic performance tests will substantiate device damage. However, latent defects are extremely difficult to prove or detect using current technology, especially after the device is assembled into a finished product.

Basic ESD Events—What Causes Electronic Devices to Fail?

ESD damage is usually caused by one of three events: direct electrostatic discharge to the device, electrostatic discharge from the device or field-induced discharges. Whether or not damage occurs to an ESD sensitive item (ESDS) by an ESD event is determined by the device’s ability to dissipate the energy of the discharge or withstand the voltage levels involved. The level at which a device fails is known as the device’s ESD sensitivity or ESD susceptibility.

Discharge to the Device

An ESD event can occur when any charged conductor (including the human body) discharges to an item. A cause of electrostatic damage could be the direct transfer of electrostatic charge from the human body or a charged material to the ESDS. When one walks across a floor, an electrostatic charge accumulates on the body. Simple contact (or close proximity) of a finger to the leads of an ESDS or assembly which is typically on a different electrical potential can allow the body to discharge, possibly causing ESD damage. The model used to simulate this event is the Human Body Model (HBM). A similar discharge can occur from a charged conductive object, such as a metallic tool or fixture. From the nature of the discharge, the model used to describe this event is known as the Machine Model (MM).

Discharge from the Device

The transfer of charge from an ESDS to a conductor is also an ESD event. Static charge may accumulate on the ESDS itself through handling or contact and separation with packaging materials, worksurfaces, or machine surfaces. This frequently occurs when a device moves across a surface or vibrates in a package. The model used to simulate the transfer of charge from an ESDS is referred to as the Charged Device Model (CDM). The capacitances, energies, and current waveforms involved are totally different from those of a discharge to the ESD sensitive item, resulting very likely in different failure modes.

The trend towards automated assembly would seem to solve the problems of HBM ESD events. However, it has been shown that components may be more sensitive to damage when assembled by automated equipment. A device may become charged, for example, from sliding down the feeder. If it then contacts the insertion head or any other conductive surface, a rapid discharge occurs from the device to the metal object.

Field Induced Discharges

Another electrostatic charging process that can directly or indirectly damage devices is termed Field Induction. As noted earlier, whenever any object becomes electrostatically charged, there is an electrostatic field associated with that charge. If an ESDS is placed in that electrostatic field, a charge may be induced on the item. If the item is then grounded while within the electrostatic field, a transfer of charge from the device occurs as a CDM event. If the item is removed from the region of the electrostatic field and grounded again, a second CDM event will occur as the charge (of opposite polarity from the first event) is transferred from the device.

How Much Static Protection is Needed?

Damage to an ESDS by the ESD event is determined by the device’s ability to dissipate the energy of the discharge or withstand the voltage levels involved—as explained previously these factors determine the parts ESD sensitivity or susceptibility. Test procedures based on the models of ESD events help define the sensitivity of components to ESD. Although it is known that there is very rarely a direct correlation between the discharges in the test procedures and real-world ESD events, defining the ESD sensitivity of electronic components gives some guidance in determining the degree of ESD control protection required. These procedures and more are covered in Part Five of this series.

The ESD withstand voltage is “the highest voltage level that does not cause device failure; the device passes all tested lower voltages.” Many electronic components are sensitive or susceptible to ESD damage at relatively low voltage levels. Many are susceptible at less than 100 volts, and many disk drive components withstand voltages even below 10 volts. Current trends in product design and development pack more circuitry onto these miniature devices, further increasing their sensitivity to ESD and making the potential problem even more acute. Table 3 indicates the ESD sensitivity of various types of components.

 

Table 3
ESD Sensitivity of Representative Electronic Devices
Devices or Parts with Sensitivity Associated with HBM and CDM*
Device Part or Type
Microwave devices (Schottky barrier diodes, point contact diodes and other detector diodes >1GHz)
Discrete MOSFET devices
Surface acoustic wave (SAW) devices
Junction field effect transistors (JFETs)
Charged coupled devices (CCDs)
Precision voltage regulator diodes (line of load voltage regulation, <0.5%)
Operational amplifiers (OP AMPs)
Thin film resistors
Integrated circuits
GMR and new technology Disk Drive Recording Heads
Laser Diodes
Hybrids
Very high speed integrated circuits (VHSIC)
Silicon controlled rectifiers (SCRs) with Io <0.175 amp at 10°C ambient
*Specific Sensitivity Levels are available from supplier data sheets

Summary

In this “An Introduction to ESD”, we have discussed electrostatic charge and discharge, the mechanisms of creating charge, materials, types of ESD damage, ESD events, and ESD sensitivity. We can summarize this discussion as follows:

  1. Virtually all materials, even conductors, can be triboelectrically charged.
  2. The amount of charge is affected by material type, speed of contact and separation, humidity, and several other factors.
  3. Charged objects have electrostatic fields.
  4. Electrostatic discharge can damage devices so a parameter fails immediately, or ESD damage may be a latent defect that may escape immediate detection, but may cause the device to fail prematurely.
  5. Electrostatic discharge can occur throughout the manufacturing, test, shipping, handling, or operational processes, and during field service operations.
  6. ESD damage can occur as the result of a discharge to the device, from the device, or from charge transfers resulting from electrostatic fields. Devices vary significantly in their sensitivity or susceptibility to ESD.

Protecting products from the effects of ESD damage begins by understanding these key concepts of electrostatic charges and discharges. An effective ESD control program requires an effective training program where all personnel involved understand the key concepts. See Part Two for the basic concepts of ESD control.

References

ESD-ADV 1.0, Glossary, ESD Association, Rome NY.
ESD TR20.20, Handbook, ESD Association, Rome, NY.
ESD ADV 11.2, Triboelectric Charge Accumulation Testing, ESD Association, Rome, NY.
ANSI/ESD S20.20—Standard for the Development of Electrostatic Discharge Control Program, ESD Association, Rome, NY.